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I960 Datasheet(PDF) 27 Page - Intel Corporation |
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I960 Datasheet(HTML) 27 Page - Intel Corporation |
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27 / 70 page ![]() i960 ® Rx I/O Processor at 3.3 V ADVANCE INFORMATION 21 3.1.2 352-Lead HL-PBGA Package Figure 3. 352L HL-PBGA Package Diagram (Top and Side View) NOTES: 1. All dimensions and tolerances conform to ANSI Y14.5M 1982. 2. All dimensions are in millimeters. 3. Tin/Lead mix: 63%/37%. 4. Pad plating method: Electrolytic. 5. Encapsulant size: 22.38 x 22.38 mm (max). Body Size Ball spacing is 1.27 mm 35 ± 0.10 mm 1.54 ± 0.13 mm 35 ± 0.10 mm Ball Footprint 31.75 mm 0.91 ± 0.06 mm Package Height 0.63 ± 0.07 mm Ball width is 0.75 ± 0.15 mm 1.63 mm Ball A1 Corner i960® GC80960RxZZ FFFFFFFF SS Q QQQQ © ‘9x ‘9x M i |
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