I960 datasheet(37/70 Pages) INTEL

37 / 70 page

i960

® Rx I/O Processor at 3.3 V

ADVANCE INFORMATION

3.2

Package Thermal Specifications

The device is specified for operation when TC (case

temperature) is within the range of 0° C to 95° C.

Case

temperature

may

measured

any

environment to determine whether the processor is

within specified operating range. Measure the case

temperature at the center of the top surface,

opposite the ballpad.

3.2.1

Thermal Specifications

This section defines the terms used for thermal

analysis.

3.2.1.1 Ambient Temperature

Ambient temperature, TA, is the temperature of the

ambient air surrounding the package. In a system

environment, ambient temperature is the temper-

ature of the air upstream from the package.

3.2.1.2 Case Temperature

To ensure functionality and reliability, the device is

specified for proper operation when the case

temperature, TC, is within the specified range in

Table 16, Operating Conditions (pg. 34).

When measuring case temperature, attention to

detail is required to ensure accuracy. If a thermo-

couple is used, calibrate it before taking measure-

ments. Errors may result when the measured

surface temperature is affected by the surrounding

ambient air temperature. Such errors may be due to

a poor thermal contact between thermocouple

junction and the surface, heat loss by radiation, or

conduction through thermocouple leads.

To minimize measurement errors:

• Use a 35 gauge K-type thermocouple or equiv-

alent.

• Attach the thermocouple bead or junction to the

package top surface at a location corresponding to

the center of the die (Figure 5). The center of the

die gives a more accurate measurement and less

variation as the boundary condition changes.

• Attach the thermocouple bead or junction at a 90°

angle by an adhesive bond (such as thermal epoxy

or heat-tolerant tape) to the package top surface

as shown in Figure 5. When a heat sink is

attached, drill a hole through the heat sink to allow

contact with the package above the center of the

die. The hole diameter should be no larger than

3.8 mm as shown in Figure 6.

Figure 5. Thermocouple Attachment -

No Heat Sink

Figure 6. Thermocouple Attachment -

With Heat Sink

3.2.1.3 Thermal Resistance

The thermal resistance value for the case-to-

ambient,

CA, is used as a measure of the cooling

solution’s thermal performance.

Thermocouple Bead

Thermocouple Wire

Epoxy Fillet

Thermocouple

3.8 mm Diameter Hole

Heat Sink

I960 Datasheet(PDF) 37 Page - Intel Corporation

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