I960 datasheet(38/70 Pages) INTEL

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i960® Rx I/O Processor at 3.3 V

ADVANCE INFORMATION

3.2.2

Thermal Analysis

This thermal analysis is based on the following

assumptions:

• Power dissipation is a constant 5 W.

• Maximum case temperature is 95° C.

Table 14 lists the case-to-ambient thermal resis-

tances of the 80960RP for different air flow rates

with and without a heat sink.

To calculate TA, the maximum ambient temperature

to conform to a particular case temperature:

TA = TC - P (θCA)

Compute P by multiplying ICC and VCC. Valuesfor

JC and θCA are given in Table 14.

Junction temperature (TJ) is commonly used in

reliability calculations. TJ can be calculated from θJC

(thermal resistance from junction to case) using the

following equation:

TJ = TC + P (θJC)

Similarly, when TA is known, the corresponding case

temperature (TC) can be calculated as follows:

TC = TA + P (θCA)

The

JA (Junction to Ambient) for this package is

currently estimated at 9.74° C/Watt with no airflow.

θJA = θJC + θCA

Table 14. 352-Lead HL-PBGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

(0.25)

100

(0.50)

200

(1.01)

300

(1.52)

400

(2.03)

600

(3.04)

800

(4.06)

JC (Junction-to-Case)

0.60

CA (Case-to-Ambient)

Without Heatsink

9.14

7.64

6.58

6.11

5.79

5.61

5.49

5.47

CA (Case-to-Ambient)

With Heatsink2

7.31

6.00

5.21

4.80

4.52

4.37

4.26

4.23

NOTES:

1. This table applies to a HL-PBGA device soldered directly onto a board.

2. See Table 15 for heatsink information.

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