ADSP-21364SBBCZENG datasheet(44/52 Pages) AD

44 / 52 page

Rev. PrB

Page 44 of 52

September 2004

ADSP-21364

Preliminary Technical Data

THERMAL CHARACTERISTICS

The ADSP-21364 processor is rated for performance to a maxi-

mum junction temperature of 125°C.

Table 39 airflow measurements comply with JEDEC standards

JESD51-2 and JESD51-6 and the junction-to-board measure-

ment complies with JESD51-8. Test board and thermal via

design comply with JEDEC standards JESD51-9 (Mini-BGA)

and JESD51-5 (Integrated Heatsink LQFP). The junction-to-

case measurement complies with MIL- STD-883. All measure-

ments use a 2S2P JEDEC test board.

Industrial applications using the Mini-BGA package require

thermal vias, to an embedded ground plane, in the PCB. Refer to

JEDEC Standard JESD51-9 for printed circuit board thermal

ball land and thermal via design information. Industrial applica-

tions using the LQFP package require thermal trace squares and

thermal vias, to an embedded ground plane, in the PCB. The

bottom side heat slug must be soldered to the thermal trace

squares. Refer to JEDEC Standard JESD51-5 for more

information.

To determine the Junction Temperature of the device while on

the application PCB, use:

where:

TJ = Junction temperature ×C

TCASE = Case temperature (×C) measured at the top center of

the package

ΨJT = Junction-to-Top (of package) characterization parameter

is the Typical value from Table 39 and Table 41.

PD = Power dissipation (see EE Note #216)

Values of θJA are provided for package comparison and PCB

design considerations. θJA can be used for a first order approxi-

mation of TJ by the equation:

where:

TA = Ambient Temperature

Values of θJC are provided for package comparison and PCB

design considerations when an external heatsink is required.

Values of θJB are provided for package comparison and PCB

design considerations.

Figure 41. Typical Output Delay or Hold vs. Load Capacitance

(at Ambient Temperature)

LOAD CAPACITANCE (pF)

200

100

150

-4

-2

Y = 0.0488X - 1.5923

TCASE

()

Table 39. Thermal Characteristics for 136 Ball Mini-BGA

(No thermal vias in PCB)1

Parameter

Condition

Typical

Unit

θJA

Airflow = 0 m/s

25.20

°C/W

θJMA

Airflow = 1 m/s

21.70

°C/W

θJMA

Airflow = 2 m/s

20.80

°C/W

θJC

5.00

°C/W

ΨJT

Airflow = 0 m/s

0.140

°C/W

ΨJMT

Airflow = 1 m/s

0.330

°C/W

ΨJMT

Airflow = 2 m/s

0.410

°C/W

Table 40. Thermal Characteristics for 136 Ball Mini-BGA

(Thermal vias in PCB)1

Parameter

Condition

Typical

Unit

θJA

Airflow = 0 m/s

22.50

°C/W

θJMA

Airflow = 1 m/s

19.30

°C/W

θJMA

Airflow = 2 m/s

18.40

°C/W

θJC

5.00

°C/W

ΨJT

Airflow = 0 m/s

0.130

°C/W

ΨJMT

Airflow = 1 m/s

0.300

°C/W

ΨJMT

Airflow = 2 m/s

0.360

°C/W

Table 41. Thermal Characteristics for 144-Lead Integrated

Heatsink (INT–HS) LQFP (With heat slug not soldered to

PCB)1

Parameter

Condition

Typical

Unit

θJA

Airflow = 0 m/s

26.08

°C/W

θJMA

Airflow = 1 m/s

24.59

°C/W

θJMA

Airflow = 2 m/s

23.77

°C/W

θJC

6.83

°C/W

ΨJT

Airflow = 0 m/s

0.236

°C/W

ΨJMT

Airflow = 1 m/s

0.427

°C/W

ΨJMT

Airflow = 2 m/s

0.441

°C/W

()

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