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ADSP-21364SBBCZENG Datasheet(PDF) 16 Page - Analog Devices |
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ADSP-21364SBBCZENG Datasheet(HTML) 16 Page - Analog Devices |
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16 / 52 page ![]() Rev. PrB | Page 16 of 52 | September 2004 ADSP-21364 Preliminary Technical Data MAXIMUM POWER DISSIPATION The data in this table is based on theta JA (θJA) established per JEDEC standards JESD51-2 and JESD51-6. See Engineer-to- Engineer note (EE-TBD) for further information. For informa- tion on package thermal specifications, see Thermal Characteristics on Page 44. ABSOLUTE MAXIMUM RATINGS ESD SENSITIVITY TIMING SPECIFICATIONS The ADSP-21364’s internal clock (a multiple of CLKIN) pro- vides the clock signal for timing internal memory, processor core, serial ports, and parallel port (as required for read/write strobes in asynchronous access mode). During reset, program the ratio between the processor’s internal clock frequency and external (CLKIN) clock frequency with the CLKCFG1–0 pins. To determine switching frequencies for the serial ports, divide down the internal clock, using the programmable divider con- trol of each port (DIVx for the serial ports). The ADSP-21364’s internal clock switches at higher frequencies than the system input clock (CLKIN). To generate the internal clock, the processor uses an internal phase-locked loop (PLL). This PLL-based clocking minimizes the skew between the sys- tem clock (CLKIN) signal and the processor’s internal clock (the clock source for the parallel port logic and I/O pads). Max Ambient Temp1 1 Power Dissipation greater than that listed above may cause permanent damage to the device. For more information, see Thermal Characteristics on Page 44. 144 INT–HS LQFP2 2 Heat slug soldered to PCB 144 INT–HS LQFP3 3 Heat slug not soldered to PCB 136 Mini- BGA4 4 Thermal vias in PCB 136 Mini- BGA5 5 No thermal vias in PCB 70 °C 3.33W 2.10W 2.44W 2.18W 85 °C 2.42W N/A 1.77W N/A 105 °C1.21W N/A N/A N/A Parameter Rating Internal (Core) Supply Voltage (VDDINT) 1 1 Stresses greater than those listed above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. –0.3 V to +1.5 V Analog (PLL) Supply Voltage (AVDD) 1 –0.3 V to +1.5 V External (I/O) Supply Voltage (VDDEXT) 1 –0.3 V to +4.6 V Input Voltage–0.5 V to VDDEXT 1 + 0.5 V Output Voltage Swing–0.5 V to VDDEXT 1 + 0.5 V Load Capacitance1 200 pF Storage Temperature Range1 –65 °C to +150°C Junction Temperature under Bias 125 °C CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADSP-21364 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. |
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