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DA6021 Datasheet(PDF) 220 Page - Renesas Technology Corp |
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DA6021 Datasheet(HTML) 220 Page - Renesas Technology Corp |
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220 / 225 page ![]() DA6021 HIGHLY INTEGRATED POWER MANAGEMENT IC FOR INTEL® ATOM™ Z3000 PROCESSOR Company Confidential Data Sheet Version 3.A - Final 31-Jan-14 © 2014 Dialog Semiconductor GmbH 220 of 224 www.dialog-semiconductor.com Figure 76: Package Outline Drawing and Dimensions Soldering Profile 25.5 A PCBA reflow profile depends on the thermal mass of the entire populated board. The actual temperature used in the reflow oven is a function of: • Solder paste types • Board density • Component location • Component mass • Board finish Referring to IPC/JEDEC J-STD-20D.a the figure and table below show the recommended reflow profile condition for 3Sn/37Pb and lead free solder. |
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