AD9694 datasheet(11/101 Pages) AD

11 / 101 page

Data Sheet

AD9694

Rev. 0 | Page 11 of 101

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter

Rating

Electrical

AVDD1 to AGND

1.05 V

AVDD1_SR to AGND

1.05 V

AVDD2 to AGND

2.00 V

AVDD3 to AGND

2.70 V

DVDD to DGND

1.05 V

DRVDD1 to DRGND

1.05 V

DRVDD2 to DRGND

2.00 V

SPIVDD to AGND

2.00 V

VIN±x to AGND

−0.3 V to AVDD3 + 0.3 V

CLK± to AGND

−0.3 V to AVDD1 + 0.3 V

SCLK, SDIO, CSB to DGND

−0.3 V to SPIVDD + 0.3 V

PDWN/STBY to DGND

−0.3 V to SPIVDD + 0.3 V

SYSREF± to AGND_SR

0 V to 2.5 V

SYNCINB±AB/SYNCINB±CD to

DRGND

0 V to 2.5 V

Environmental

Operating Junction Temperature

Range

−40°C to +105°C

Maximum Junction Temperature

125°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC_BOT is the bottom junction to case thermal resistance.

Table 9. Thermal Resistance

PCB Type

Airflow Velocity (m/sec)

θJA

θJC_BOT

Unit

JEDEC

2s2p Board

0.0

21.581, 2

1.951, 5

°C/W

1.0

17.941, 2

N/A4

°C/W

2.5

16.581, 2

N/A4

°C/W

10-Layer

Board

0.0

9.74

1.00

°C/W

Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board.

Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

Per JEDEC JESD51-8 (still air).

N/A means not applicable.

Per MIL-STD 883, Method 1012.1.

ESD CAUTION

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