LTM4677 datasheet(108/110 Pages) AD

108 / 110 page

LTC3888-1

108

Rev. 0

For more information www.analog.com

PACKAGE DESCRIPTION

5.00

±0.10

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE

OUTLINE MO-220

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

BOTTOM VIEW—EXPOSED PAD

6.65

±0.10

6.40 REF

8.00

±0.10

0.75

± 0.05

0.75

±0.05

R = 0.10

TYP

0.20

±0.05

(UHG52) QFN 0716 REV Ø

0.40 BSC

0.27 REF

0.200 REF

0.00 – 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

3.20 REF

0.40

±0.10

0.00 – 0.05

0.70

±0.05

0.40 BSC

0.80 BSC

6.40 REF

3.20 REF

4.10

±0.05

5.50

±0.05

0.20

±0.05

6.65

±0.10

3.65

±0.10

7.10

±0.05

8.50

±0.05

PACKAGE

OUTLINE

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35

× 45° CHAMFER

UHG Package

52-Lead Plastic QFN (5mm

× 8mm)

(Reference LTC DWG # 05-08-1550 Rev Ø)

3.65

±0.10

LTM4677 Datasheet(PDF) 108 Page - Analog Devices

LTM4677 Datasheet(HTML) 108 Page - Analog Devices

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