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376 Datasheet(PDF) 94 Page - Intel Corporation

Part # 376
Description  376TM HIGH PERFORMANCE 32-BIT EMBEDDED PROCESSOR
PDF  95 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

376 Datasheet(HTML) 94 Page - Intel Corporation

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376 EMBEDDED PROCESSOR
90 REVISION HISTORY
The sections significantly revised since version -003 are
Section 10
Added FLT pin
Section 44
Added description of FLOAT operation and ONCE Mode Figure 420 is new
Section 46
Added revision identifier information for change to CHMOS IV manufacturing process
Section 50
Both packages now specified for 0 C – 115 C case temperature operation Thermal resist-
ance values changed
Section 63
ICC Max specifications changed from 400 mA (cold) and 360 mA (hot) to 275 mA (cold 16
MHz) and 305 mA (cold 20 MHz)
Section 64
HLDA Valid Delay t14 min changed from 6 ns to 4 ns Added 20 MHz AC specifications in
Table 65 Replaced Capacitive Derating Curves in Figures 68 – 610 to reflect new manufac-
turing process Replaced ICC vs Frequency data (Figure 611) to reflect new specifications
The sections significantly revised since version -002 are
Section 10
Modified table 11 to list pins in alphabetical order
The sections significantly revised since version -001 are
Section 20
Figure 20 was updated to show the 16-bit registers SI DI BP and SP
Section 21
Figure 22 was updated to show the correct bit polarity for bit 4 in the CR0 register
Section 21
Tables 21 and 22 were updated to include additional information on the EFLAGs and CR0
registers
Section 23
Figure 23 was updated to more accurately reflect the addressing mechanism of the 80376
Section 26
In the subsection Maskable Interrupt a paragraph was added to describe the effect of
interrupt gates on the IF EFLAGs bit
Section 28
Table 27 was updated to reflect the correct power up condition of the CR0 register
Section 210
Figure 26 was updated to show the correct bit positions of the BT BS and BD bits in the
DR6 register
Section 30
Figure 31 was updated to clearly show the address calculation process
Section 32
The subsection DESCRIPTORS was elaborated upon to clearly define the relationship be-
tween the linear address space and physical address space of the 80376
Section 32
Figures 33 and 34 were updated to show the AVL bit field
Section 33
The last sentence in the first paragraph of subsection PROTECTION AND IO PERMIS-
SION BIT MAP
was deleted This was an incorrect statement
Section 41
In the Subsection ADDRESS BUS (BHE BLE A23–A1 last sentence in the first paragraph
was updated to reflect the numerics operand addresses as 8000FCH and 8000FEH Be-
cause the 80376 sometimes does a double word IO access a second access to 8000FEH
can be seen
Section 41
The Subsection Hold Lantencies was updated to describe how 32-bit and unaligned ac-
cesses are internally locked but do not assert the LOCK signal
Section 42
Table 46 was updated to show the correct active data bits during a BLE assertion
94



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