UPD17015GS datasheet(116/120 Pages) NEC

116 / 120 page

116

µPD17015

20. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the

µPD17015.

For details of the recommended soldering conditions, refer to our document

SMD Surface Mount Technology

Manual (IEI-1207).

Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under

different conditions.

Table 20-1

Soldering Conditions for Surface-Mount Devices

µPD17015GS-×××-GJG: 38-pin plastic shrink SOP (300 mil)

Soldering conditions

Peak package’s surface temperature: 235

°C

Reflow time: 30 seconds or less (at 210

°C or more)

Maximum allowable number of reflow processes: 2

(1) Do not start reflow-soldering the device if its temperature is

higher than the room temperature because of a previous

reflow soldering.

(2) Do not use water for flux cleaning before a second reflow

soldering.

Peak package’s surface temperature: 215

°C

Reflow time: 40 seconds or less (at 200

°C or more)

Maximum allowable number of reflow processes: 2

(1) Do not start reflow-soldering the device if its temperature is

higher than the room temperature because of a previous

reflow soldering.

(2) Do not use water for flux cleaning before a second reflow

soldering.

Solder temperature: 260

°C or less

Flow time: 10 seconds or less

Number of flow process: 1

Preheating temperature: 120

°C max.

(measured on the package surface)

Terminal temperature: 300

°C or less

Flow time: 3 seconds or less (for each side of device)

Symbol

IR35-00-2

VP15-00-2

WS60-00-1

—

Soldering process

Infrared ray reflow

VPS

Wave soldering

Partial heating method

Caution Do not apply more than a single process at once, except for "Partial heating method."

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