LP3910 datasheet(7/72 Pages) TI1

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LP3910

www.ti.com

SNVS481M – NOVEMBER 2006 – REVISED DECEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

CHG_DET

–0.3

6.5

Battery voltage

VBATT1, 2, 3

–0.3

USBPWR, VIN1,VIN2,VIN3,VIN4, VDD1,VDD2,VDD3

–0.3

6.2

Voltage

All other pins

–0.3

VDD + 0.3

Power dissipation (TA = 70°C)

(4)

2.6

Storage temperature, Tstg

–45

150

ºC

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (RθJA × PD-MAX).

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typical) and

disengages at TJ = 140°C (typical).

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

discharge

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

NOM

MAX

UNIT

CHG_DET

4.5

USBPWR

4.35

VBATT1, 2, 3

4.5

VIN1, VIN2, VIN3, VIN4, VDD1, VDD2, VDD3

2.5

VDDIO

2.5

VDD

Junction temperature, TJ

–40

125

°C

Ambient temperature, TA

–40

°C

Power dissipation, TJ-MAX and TA-MAX

1.6

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Minimum and maximum limits are specified by design, test, or statistical analysis. Nominal numbers are not ensured, but do represent

the most likely norm.

(3)

Nominal values and limits are for TJ = 25°C.

7.4 Thermal Information

LP3910

THERMAL METRIC(1)

NJV (WQFN)

UNIT

48 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

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