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LMK04832PAP/EM Datasheet(PDF) 91 Page - Texas Instruments |
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LMK04832PAP/EM Datasheet(HTML) 91 Page - Texas Instruments |
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91 / 103 page ![]() Resistors, Ferrite Beads, and Capacitors on back side of board provide power supply ltering Emi er resistors for LVPECL can be put on back side of the board. Figure 9-8. Bottom Layer 9.4.3 Thermal Management Power consumption can be high enough to require attention from thermal management. For reliability and performance reasons, the die temperature should be limited to a maximum of 125°C. That is, as an estimate, TA (ambient temperature) plus device power consumption times RθJA should not exceed 125°C. www.ti.com LMK04832-SEP SNAS838 – OCTOBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 91 Product Folder Links: LMK04832-SEP |
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