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LMK04832PAP/EM Datasheet(PDF) 96 Page - Texas Instruments |
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LMK04832PAP/EM Datasheet(HTML) 96 Page - Texas Instruments |
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96 / 103 page  www.ti.com EXAMPLE STENCIL DESIGN ( 4.44) (11.4) 60X (0.5) 64X (1.5) 64X (0.3) (11.4) 3.75 X 3.75 0.178 4.06 X 4.06 0.152 4.44 X 4.44 (SHOWN) 0.127 5 X 5 0.1 SOLDER STENCIL OPENING STENCIL THICKNESS PowerPAD - 1.2 mm max height PAP0064M PLASTIC QUAD FLATPACK 4221602/A 07/2014 TM NOTES: (continued) 9. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 10. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE EXPOSED PAD 100% PRINTED SOLDER COVERAGE BY AREA SCALE:6X SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES 0.127 THICK STENCIL BASED ON SYMM SYMM 64 49 17 32 33 48 1 16 BY SOLDER MASK METAL COVERED LMK04832-SEP SNAS838 – OCTOBER 2022 www.ti.com 96 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LMK04832-SEP |
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