GD3160 datasheet(11/114 Pages) NXP

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NXP Semiconductors

GD3160

Advanced IGBT/SiC gate driver

[5]

ADC performance is guaranteed by design up to 500 μA injected current on AMUXIN pin.

[6]

Human Body Model (HBM) at device level

ANSI/ESDA/JEDEC JS-001: 2010 Model HBM (human body model)

Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)

Test points: pin to GND1 and pin to GND2

[7]

Charged Device Model (CDM)

ANSI/ESD S5.3.1-2009

ESD Association Standard for Electrostatic Discharge Sensitivity Testing - Charged Device Model (CDM) - Component Level

[8]

Module Level ESD Tests

ISO 10605:2008/Cor. 1:2010(E)

Road vehicles – Test methods for electrical disturbances from electrostatic discharge

[9]

Pulse width = 10 ns

8.3 Thermal characteristics

Exceeding these ratings may cause a malfunction or permanent damage to the device.

Symbol

Description (rating)

Min

Max

Unit

Thermal ratings

Operating junction temperature

−40

150

°C

TSTG

Storage temperature

−65

150

°C

TOTSDth

Overtemperature shutdown threshold of IC

180

210

°C

TPPRT

Peak package reflow temperature during reflow

[1] [2]

—

260

°C

MSL

Moisture Sensitivity Level

—

Table 5. Thermal ratings

[1]

NXP's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture

Sensitivity Levels (MSL), contact NXP.

[2]

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction

or permanent damage to the device.

Symbol

Description (rating)

Min

Max

Unit

Thermal resistance ratings

RθJA

Junction-to-Ambient thermal resistance

[1] [2]

—

°C/W

RθJB

Junction-to-Board thermal resistance

[3]

—

°C/W

Table 6. Thermal resistance characteristics

[1]

Per EIA/JESD51-2A Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

[2]

Per EIA/JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

[3]

JEDEC high-K thermal test board without thermal attachment.

GD3160

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 13 — 6 May 2024

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