82G33 datasheet(388/437 Pages) INTEL

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Ballout and Package Information

388

Datasheet

Ballout and Package

Information

This chapter provides the ballout and package information.

12.1

Ballout

Figure 12-1, Figure 12-2, and Figure 12-3 show the (G)MCH ballout diagram as

viewed from the top side of the package. The figures are divided into a left-side view

and right-side view of the package.

Note: Notes for Figure 12-1, Figure 12-2, and Figure 12-3, and Table 12-1 and Table 12-2.

1. Balls that are listed as RSVD are reserved.

2. Some balls marked as reserved (RSVD) are used in XOR testing. See Chapter 14

for details.

3. Balls that are listed as NC are No Connects.

4. Analog Display Signals (CRT_RED, CRT_REDB, CRT_GREEN, CRT_GREENB,

CRT_BLUE, CRT_BLUEB, CRT_IREF, CRT_HSYNC, CRT_VSYNC, CRT_DDC_CLK,

CRT_DDC_DATA) and the SDVO_CTRLCLK and SDVO_CTRLDATA signals are not

used on the 82P35 MCH. Contact your Intel field representative for proper

termination of the corresponding balls.

5. For the 82Q35, 82Q33, 82G33 GMCH, the PCI Express and SDVO signals are

multiplexed. However, only the PCI Express signal name is included in the

following ballout figures and table. See Section 2.10 for the PCI Express to SDVO

signal name mapping.

82G33 Datasheet(PDF) 388 Page - Intel Corporation