DM504 datasheet(83/211 Pages) TI1

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DM504

www.ti.com

SPRS977A – NOVEMBER 2016 – REVISED JANUARY 2017

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Specifications

Table 5-14. ADC Electrical Specifications (continued)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

CONDITIONS

MIN

NOM

MAX

UNIT

Input Sampling Capacitance

3.2

Input Frequency adc_in[7:0]

kHz

Signal-to-Noise Ratio (SNR)

Input Signal: 30 kHz sine wave at -0.5 dB

Full Scale

Total Harmonic Distortion

(THD)

1.8 Vpp, 30 kHz sine wave

Spurious Free Dynamic

Range

1.8 Vpp, 30 kHz sine wave

Signal-to-Noise Plus

Distortion

1.8 Vpp, 30 kHz sine wave

adc_vrefp Input Impedance

Sampling Dynamics

Time from Start to Start

Clock Cycles

Conversion Time + Error Correction

10 + 1

Clock Cycles

Acquisition time

Clock Cycles

Throughput Rate

CLK = 20 MHz ( Pin : clk)

MSPS

Channel to Channel Isolation

ADC Clock Frequency

See

Table 5-1

MHz

(1) Connect adc_vrefp to vdda_adc when not using a positive external reference voltage.

(2) This parameter is valid when the respective AIN terminal is configured to operate as a general-purpose ADC input.

(3) The maximum sample rate assumes a conversion time of 13 ADC clock cycles with the acquisition time configured for the minimum of 2

ADC clock cycles, where it takes a total of 15 ADC clock cycles to sample the analog input and convert it to a positive binary weighted

digital value.

Table 5-15. ADC Power Supply Requirements

over operating free-air temperature range (unless otherwise noted)

PARAMETER

CONDITIONS

MIN

NOM

MAX

UNIT

VD_CORE – core supply

0.9

1.1

VDDA ( at the IO pin )

1.62

1.8

1.89

TEMPERATURE RANGE

Specified Performance

-40

125

5.8

Thermal Characteristics

For reliability and operability concerns, the maximum junction temperature of the Device has to be at or

below the TJ value identified in , Recommended Operating Conditions.

A BCI compact thermal model for this Device is available and recommended for use when modeling

thermal performance in a system.

Therefore, it is recommended to perform thermal simulations at the system level with the worst case

device power consumption.

5.8.1

Package Thermal Characteristics

Table 5-16 provides the thermal resistance characteristics for the package used on this device.

NOTE

Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABE

package.

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