DM504 datasheet(84/211 Pages) TI1

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DM504

SPRS977A – NOVEMBER 2016 – REVISED JANUARY 2017

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Specifications

Table 5-16. Thermal Resistance Characteristics

NO.

PARAMET

DESCRIPTION

°C/W(1)

AIR FLOW (m/s)(2)

RΘJC

Junction-to-case

2.37

N/A

RΘJB

Junction-to-board

8.77

N/A

RΘJA

Junction-to-free air

21.6

Junction-to-moving air

19.3

18.5

17.9

ΨJT

Junction-to-free air

1.07

Junction-to-package top

1.13

T10

1.13

T11

ΨJB

Junction-to-free air

9.07

T12

Junction-to-board

8.67

T13

8.60

T14

8.50

(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

–

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

–

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

–

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

–

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

–

JESD51-9, Test Boards for Area Array Surface Mount Packages

(2) m/s = meters per second

5.9

Timing Requirements and Switching Characteristics

5.9.1

Timing Parameters and Information

The timing parameter symbols used in the timing requirement and switching characteristic tables are

created in accordance with JEDEC Standard 100. To shorten the symbols, some of pin names and other

related terminologies have been abbreviated as follows:

Table 5-17. Timing Parameters

SUBSCRIPTS

SYMBOL

PARAMETER

Cycle time (period)

Delay time

dis

Disable time

Enable time

Hold time

Setup time

START

Start bit

Transition time

Valid time

Pulse duration (width)

Unknown, changing, or don't care level

Fall time

High

Low

Rise time

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