MSP430F5259 datasheet(56/107 Pages) TI1

56 / 107 page

MSP430F5259, MSP430F5258, MSP430F5257, MSP430F5256

MSP430F5255, MSP430F5254, MSP430F5253, MSP430F5252

SLAS903A – MAY 2013 – REVISED JULY 2013

www.ti.com

Crystal Oscillator, XT1, Low-Frequency Mode

(1)

(continued)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fOSC = 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 0,

1000

TA = 25°C, CL,eff = 6 pF

tSTART,LF

Startup time, LF mode

3.0 V

fOSC = 32768 Hz, XTS = 0,

XT1BYPASS = 0, XT1DRIVEx = 3,

500

TA = 25°C, CL,eff = 12 pF

Crystal Oscillator, XT2

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

(1) (2)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

fOSC = 4 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 0,

200

TA = 25°C

fOSC = 12 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 1,

260

TA = 25°C

XT2 oscillator crystal current

IDVCC.XT2

3.0 V

µA

consumption

fOSC = 20 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 2,

325

TA = 25°C

fOSC = 32 MHz, XT2OFF = 0,

XT2BYPASS = 0, XT2DRIVEx = 3,

450

TA = 25°C

XT2 oscillator crystal frequency,

fXT2,HF0

XT2DRIVEx = 0, XT2BYPASS = 0(3)

MHz

mode 0

XT2 oscillator crystal frequency,

fXT2,HF1

XT2DRIVEx = 1, XT2BYPASS = 0 (3)

MHz

mode 1

XT2 oscillator crystal frequency,

fXT2,HF2

XT2DRIVEx = 2, XT2BYPASS = 0 (3)

MHz

mode 2

XT2 oscillator crystal frequency,

fXT2,HF3

XT2DRIVEx = 3, XT2BYPASS = 0 (3)

MHz

mode 3

XT2 oscillator logic-level square-

XT2BYPASS = 1(4) (3)

fXT2,HF,SW

wave input frequency, bypass

0.7

MHz

XT2BYPASSLV = 0 or 1

mode

XT2DRIVEx = 0, XT2BYPASS = 0,

450

fXT2,HF0 = 6 MHz, CL,eff = 15 pF

XT2DRIVEx = 1, XT2BYPASS = 0,

320

fXT2,HF1 = 12 MHz, CL,eff = 15 pF

Oscillation allowance for

OAHF

Ω

HF crystals(5)

XT2DRIVEx = 2, XT2BYPASS = 0,

200

fXT2,HF2 = 20 MHz, CL,eff = 15 pF

XT2DRIVEx = 3, XT2BYPASS = 0,

200

fXT2,HF3 = 32 MHz, CL,eff = 15 pF

(1)

Requires external capacitors at both terminals. Values are specified by crystal manufacturers.

(2)

To improve EMI on the XT2 oscillator the following guidelines should be observed.

(a) Keep the traces between the device and the crystal as short as possible.

(b) Design a good ground plane around the oscillator pins.

(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.

(e) Use assembly materials and techniques that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.

(f) If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.

(3)

This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device

operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.

(4)

When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined

in the Schmitt-trigger Inputs section of this datasheet. When in crystal bypass mode, XT2IN can be configured so that it can support an

input digital waveform with swing levels from DVSS to DVCC (XT2BYPASSLV = 0) or DVSS to DVIO (XT2BYPASSLV = 1). In this case,

it is required that the pin be configured properly for the intended input swing.

(5)

Oscillation allowance is based on a safety factor of 5 for recommended crystals.

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