| Electronic Components Datasheet Search |
|
DA9021 Datasheet(PDF) 138 Page - Dialog Semiconductor |
|
|
|||||||||||||||||||||||||||||
DA9021 Datasheet(HTML) 138 Page - Dialog Semiconductor |
|
138 / 142 page ![]() DA9021/22 System PMIC with high efficiency USB power manager Company confidential Datasheet Revision 2.5 17-Feb-2017 CFR0011-120-00 Rev 5 138 of 142 © 2017 Dialog Semiconductor 24.5 DA9021 thermal connection, land pad and stencil design ● The DA9021 provides a centre ground plane, which is soldered directly to the PCB’s centre ground pad. This PCB ground pad must be connected with as many vias and as direct as possibl e to the PCB’s main ground plane in order to achieve good thermal performance. ● Solder mask openings for the ground pad must be split by following a certain pattern like stripes or round shapes or squares, as a solid square would apply too much solder paste and the signal pads might not be connected properly. ● As DA9021 also provides different sizes of the signal pads, some adaption of the mask openings might be required as well (generally small pads a bit larger, large pads a bit smaller than the pad itself). Vias inside or next to the pads should be filled. An appropriately fine solder paste is required. |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |