GS3590 datasheet(4/118 Pages) SEMTECH

4 / 118 page

GS3590

Final Data Sheet Rev.4



PDS-061414 September 2017

4 of 118

Semtech

Proprietary & Confidential

www.semtech.com

4.6.2 Matrix-Scan and Shape-Scan Operation ..................................................................... 36

4.7 PRBS Generator ................................................................................................................................ 43

4.8 Output Drivers .................................................................................................................................. 46

4.8.1 Bypassed Re-timer Signal Output Control ................................................................. 46

4.8.2 Output Driver Polarity Inversion.................................................................................... 46

4.8.3 PBRS Generator on SDIO and DDO ............................................................................... 47

4.8.4 Output Driver Data Rate Selection................................................................................ 47

4.8.5 Amplitude and Pre-Emphasis Control ......................................................................... 48

4.8.6 Trace Driver DC-Coupling Requirements ................................................................... 57

4.8.7 Output State Control Modes ........................................................................................... 58

4.8.8 Output Waveform Specifications .................................................................................. 60

4.9 GPIO Controls .................................................................................................................................... 60

4.10 GSPI Host Interface ....................................................................................................................... 61

4.10.1 CS Pin..................................................................................................................................... 61

4.10.2 SDIN Pin................................................................................................................................ 61

4.10.3 SDOUT Pin ........................................................................................................................... 61

4.10.4 SCLK Pin................................................................................................................................ 63

4.10.5 Command Word 1 Description .................................................................................... 63

4.10.6 GSPI Transaction Timing ................................................................................................ 65

4.10.7 Single Read/Write Access............................................................................................... 67

4.10.8 Auto-increment Read/Write Access ........................................................................... 68

4.10.9 Setting a Device Unit Address...................................................................................... 69

4.10.10 Default GSPI Operation ................................................................................................ 70

4.10.11 Clear Sticky Counts Through Four Way Handshake .......................................... 71

4.10.12 Device Power-Up Sequence ....................................................................................... 71

4.10.13 Host Initiated Device Reset......................................................................................... 72

5. Register Map................................................................................................................................................... 74

5.1 Control Registers ............................................................................................................................. 74

5.2 Status Registers ................................................................................................................................ 77

5.3 Register Descriptions ..................................................................................................................... 78

5.3.1 Control Register Descriptions ......................................................................................... 78

5.3.2 Status Register Descriptions.......................................................................................... 107

6. Application Information........................................................................................................................... 114

6.1 Typical Application Circuit ......................................................................................................... 114

7. Package & Ordering Information .......................................................................................................... 115

7.1 Package Dimensions .................................................................................................................... 115

7.2 Recommended PCB Footprint .................................................................................................. 116

7.3 Packaging Data .............................................................................................................................. 116

7.4 Marking Diagram ........................................................................................................................... 117

7.5 Solder Reflow Profiles ..................................................................................................................117

7.6 Ordering Information ...................................................................................................................117

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