TMS320F datasheet(352/389 Pages) TI

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Emulation Design Considerations

C-17

Design Considerations for Using the XDS510 Emulator

Figure C–10. Connecting a Secondary JTAG Scan Path to a Scan Path Linker

TDI

TCK

TDO

TRST

TMS

TDO

TRST

TCK

TMS

TDI

DTDI0

DTMS0

DTDO0

DTCK

TDO

TRST

TCK

TMS

TDI

SPL

JTAG 0

JTAG n

DTDI1

DTMS1

DTDO1

DTDI2

DTMS2

DTDO2

DTDI3

DTMS3

DTDO3

The TRST signal from the main scan path drives all devices, even those on

the secondary scan paths of the SPL. The TCK signal on each target device

on the secondary scan path of an SPL is driven by the SPL’s DTCK signal. The

TMS signal on each device on the secondary scan path is driven by the respec-

tive DTMS signals on the SPL.

DTDO0 on the SPL is connected to the TDI signal of the first device on the sec-

ondary scan path. DTDI0 on the SPL is connected to the TDO signal of the last

device in the secondary scan path. Within each secondary scan path, the TDI

signal of a device is connected to the TDO signal of the device before it. If the

SPL is on a backplane, its secondary JTAG scan paths are on add-on boards;

if signal degradation is a problem, you may need to buffer both the TRST and

DTCK signals. Although degradation is less likely for DTMS

n signals, you may

also need to buffer them for the same reasons.

TMS320F Datasheet(PDF) 352 Page - Texas Instruments

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