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AS3524 Datasheet(PDF) 109 Page - ams AG |
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AS3524 Datasheet(HTML) 109 Page - ams AG |
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109 / 124 page ![]() AS3524 C21 / C22 austriamicrosystems Data Sheet, Confidential © 2003-2006, austriamicrosystems AG, 8141 Unterpremstaetten, Austria-Europe. All Rights Reserved. www.austriamicrosystems.com Revision 1.11 109 - 124 6 Pinout and Packaging 6.1 Package Variants CTBGA (Thin ChipArray BGA) package technology is used for multi-chip-module (MCM) packaging. 6.2 CTBGA180 Package Drawings 6.2.1 Marking Figure 42 CTBGA180 TOP View and Package Marking Package Code AYYWWZZZ A Y WW ZZZ A … for PB free Year working week assembly/packaging Free choice Figure 43 CTBGA224 Package Drawing Bottom/Side View |
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