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OR3TP12 Datasheet(PDF) 95 Page - Agere Systems

Part # OR3TP12
Description  Field-Programmable System Chip (FPSC) Embedded Master/Target PCI Interface
PDF  128 Pages
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Manufacturer  AGERE [Agere Systems]
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OR3TP12 Datasheet(HTML) 95 Page - Agere Systems

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Lucent Technologies Inc.
95
Data Sheet
ORCA OR3TP12 FPSC
March 2000
Embedded Master/Target PCI Interface
Lucent Technologies Inc.
Timing Characteristics (continued)
Table 33. OR3TP12 PCI and FPGA Interface Clock Operation Frequencies
OR3TP12 Commercial: VDD = 3.0 V to 3.6 V, 0 °C < TA < 70 °C.
* The PCI clock frequency is based on the internal register to register frequency and the 66 MHz PCI I/O specifications.
† The Maximum User Interface Clock frequencies are values based on registering all signals at the FPGA/ASIC boundary. This number
will be lower depending on the design implementation and number of FPGA logic levels into and out of the ASIC.
‡ This is the typical operating frequency for a real design that does not register signals at the FPGA/ASIC boundary.
Table 34. OR3TP12 FPGA to PCI, and PCI to FPGA, Combinatorial Path Delays
OR3TP12 Commercial: VDD = 3.0 V to 3.6 V, 0 °C < TA < 70 °C.
Notes:
On the FPGA to PCI combinatorial path delays, they include the ASIC path delay and the output buffer delay under a
10pf load. They do not include the interbuf delay on the FPGA side.
On the PCI to FPGA combinatorial path delays, they include the ASIC input buffer delay, and ASIC path delay entering the
FPGA. They do not include the interbuf delay on the FPGA side.
Description
(TI = 85 °C, VDD = min, VDD2 = min)
Speed
–7
Unit
Signal
Min
Typ
Max
Clk (PCI clock)
0
—*
66*MHz
fclk1 (user interface clock)
0
—
†
66
‡
MHz
fclk2 (user interface clock)
0
—
†
66
‡
MHz
Description
(TI = 85 °C, VDD = min, VDD2 = min)
Min
Max
Unit
Source
Destination
pci_intan (FPGA Side)
intan (PCI Side)
—
4.601
ns
clk (PCI Side)
pciclk (FPGA Side)
—
4.544
ns
rstn (PCI Side)
pci_rstn (FPGA Side)
—
2.442
ns



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