S70FS01GS datasheet(40/141 Pages) CYPRESS

40 / 141 page

S70FS01GS

Document Number: 002-03833 Rev. *C

Page 40 of 141

6.2

Physical Diagrams

6.2.1

SOIC 16-Lead, 300-mil Body Width (SL3016)

SHEET

REV

SPEC NO.

THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF CYPRESS

SEMICONDUCTOR CORPORATION. THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS CONTENTS

MAY NOT BE DISCLOSED WITHOUT WRITTEN CONSENT OF CYPRESS SEMICONDUCTOR CORPORATION.

CYPRESS

TITLE

SCALE :

Company Confidential

PACKAGE

CODE(S)

DRAWN BY

APPROVED BY

DATE

0.33 C

0.25 M

CA-B

0.20 C A-B

0.10 C

0.10 C D

2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.

3. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 mm PER SIDE.

1. ALL DIMENSIONS ARE IN MILLIMETERS.

NOTES:

D AND E1 DIMENSIONS ARE DETERMINED AT DATUM H.

FLASH, BUT INCLUSIVE OF ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD

4. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM. DIMENSIONS

5. DATUMS A AND B TO BE DETERMINED AT DATUM H.

6. "N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR THE SPECIFIED

7. THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10 TO

MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE

8. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR

LOWER RADIUS OF THE LEAD FOOT.

IDENTIFIER MUST BE LOCATED WITHIN THE INDEX AREA INDICATED.

9. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT, THEN A PIN 1

10. LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE

0.75

10.30 BSC

1.27 BSC

0.30

10.30 BSC

0.33

0°

0.25

0.20

7.50 BSC

0.10

0.31

8°

0.51

2.65

2.35

2.05

2.55

0.27

0.48

0.30

0.20

0.40

1.27

1.40 REF

0.25 BSC

5°

15°

0°

DIMENSIONS

SYMBOL

MIN.

NOM.

MAX.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER

D AND E1 ARE DETERMINED AT THE OUTMOST EXTREMES OF THE PLASTIC BODY

0.25 mm FROM THE LEAD TIP.

PROTRUSION SHALL BE 0.10 mm TOTAL IN EXCESS OF THE "b" DIMENSION AT

THE PLASTIC BODY.

PACKAGE LENGTH.

SEATING PLANE.

SO3016

KOTA

BESY

24-OCT-16

002-15547

PACKAGE OUTLINE, 16 LEAD SOIC

TO FIT

10.30X7.50X2.65 MM SO3016/SL3016/SS3016

SL3016 SS3016

S70FS01GS Datasheet(PDF) 40 Page - Cypress Semiconductor

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