HC210 datasheet(6/228 Pages) ALTERA

6 / 228 page

1–4

Altera Corporation

Preliminary

September 2008

HardCopy Series Handbook, Volume 1

Migration and

Packaging

Overview

HardCopy II devices offer pin-to-pin compatibility to the Stratix II

prototype, which makes them drop-in replacements for the FPGAs.

Therefore, the same system board and software developed for

prototyping and field trials can be retained, enabling the fastest

time-to-market for high-volume production. When migrating a specific

Stratix II FPGA to a HardCopy II device, there are a number of FPGA

prototype choices, as shown in Table 1–2. Depending on the design

resource needs, designers can choose an appropriate HardCopy II device.

Table 1–2. Stratix II FPGA to HardCopy II Migration Paths

HardCopy II

Device

Package

Stratix II Device

EP2S30

EP2S60

EP2S90

EP2S130

EP2S180

HC210W

484-pin FineLine BGA (1)

v (2)

HC210

484-pin FineLine BGA

v (2)

HC220

672-pin FineLine BGA

HC220

780-pin FineLine BGA

v (2)

HC230

1,020-pin FineLine BGA

v (2)

HC240

1,020-pin FineLine BGA

HC240

1,508-pin FineLine BGA

Notes to Table 1–2:

(1)

The HC210W device uses a wire bond package while the Stratix II FPGA prototype device uses a pin-compatible

flip-chip package.

(2)

Depending on design specific resource utilization, an opportunistic migration path may exist between this device

pair. Be sure to confirm your design is a potential candidate for such a path by fitting with the Quartus II software

and consulting an Altera applications engineer.

HC210 Datasheet(PDF) 6 Page - Altera Corporation

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