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HC210 Datasheet(PDF) 4 Page - Altera Corporation |
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HC210 Datasheet(HTML) 4 Page - Altera Corporation |
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4 / 228 page ![]() 1–2 Altera Corporation Preliminary September 2008 HardCopy Series Handbook, Volume 1 ■ System performance up to 350 MHz ■ Up to 50% power reduction (dynamic and static) for typical designs compared to Stratix II FPGA prototypes 1 The actual performance and power consumption improvements mentioned in this datasheet are design-dependent. ■ Internal Memory ● Up to 8,847,360 RAM bits available (including parity bits) ● True dual-port memory, suitable for use in first-in-first-out (FIFO) buffers ■ Phase-Locked Loops (PLLs) ● Up to 16 global clocks with 24 clocking resources per device region ● Clock control block supports dynamic clock network enable/disable and dynamic global clock network source selection ● Up to 12 PLLs (four enhanced PLLs and eight fast PLLs) per device which provide identical features as the FPGA counterparts, including spread spectrum, programmable bandwidth, clock switchover, real-time PLL reconfiguration, advanced multiplication, and phase shifting ■ I/O Standards and Intellectual Property (IP) ● Support for numerous single-ended and differential I/O standards such as LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, and LVDS ● High-speed differential I/O support on up to 116 channels with dynamic phase alignment (DPA) circuitry for 1-Gigabit-per-second (Gbps) performance ● Support for high-speed networking and communications bus standards including Parallel RapidIO, SPI-4 Phase 2 (POS-PHY Level 4), HyperTransport™ technology, and SFI-4 ● Support for high-speed external memory, including DDR and DDR2 SDRAM, RLDRAM II, QDRII SRAM, and SDR SDRAM ● Support for multiple intellectual property megafunctions from Altera MegaCore® functions, and Altera Megafunction Partners Program (AMPPSM) megafunctions ■ Packaging ● Pin-compatible with Stratix II FPGA prototypes ● Up to 951 user I/O pins available ● Available in wire bond and flip-chip space-saving FineLine BGA packages (Table 1–3). |
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