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HC210 Datasheet(PDF) 4 Page - Altera Corporation

Part # HC210
Description  HardCopy II Device Family
PDF  228 Pages
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Manufacturer  ALTERA [Altera Corporation]
Direct Link  http://www.altera.com
Logo ALTERA - Altera Corporation

HC210 Datasheet(HTML) 4 Page - Altera Corporation

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Altera Corporation
Preliminary
September 2008
HardCopy Series Handbook, Volume 1
System performance up to 350 MHz
Up to 50% power reduction (dynamic and static) for typical designs
compared to Stratix II FPGA prototypes
1
The actual performance and power consumption improvements
mentioned in this datasheet are design-dependent.
Internal Memory
Up to 8,847,360 RAM bits available (including parity bits)
True dual-port memory, suitable for use in first-in-first-out
(FIFO) buffers
Phase-Locked Loops (PLLs)
Up to 16 global clocks with 24 clocking resources per device
region
Clock control block supports dynamic clock network
enable/disable and dynamic global clock network source
selection
Up to 12 PLLs (four enhanced PLLs and eight fast PLLs) per
device which provide identical features as the FPGA
counterparts, including spread spectrum, programmable
bandwidth, clock switchover, real-time PLL reconfiguration,
advanced multiplication, and phase shifting
I/O Standards and Intellectual Property (IP)
Support for numerous single-ended and differential I/O
standards such as LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL,
and LVDS
High-speed differential I/O support on up to 116 channels with
dynamic phase alignment (DPA) circuitry for
1-Gigabit-per-second (Gbps) performance
Support for high-speed networking and communications bus
standards including Parallel RapidIO, SPI-4 Phase 2 (POS-PHY
Level 4), HyperTransport™ technology, and SFI-4
Support for high-speed external memory, including DDR and
DDR2 SDRAM, RLDRAM II, QDRII SRAM, and SDR SDRAM
Support for multiple intellectual property megafunctions from
Altera MegaCore® functions, and Altera Megafunction Partners
Program (AMPPSM) megafunctions
Packaging
Pin-compatible with Stratix II FPGA prototypes
Up to 951 user I/O pins available
Available in wire bond and flip-chip space-saving
FineLine BGA packages (Table 1–3).



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