W97AH6KB datasheet(59/127 Pages) WINBOND

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W97AH6KB / W97AH2KB

Publication Release Date: May 15, 2014

Revision: A01-001

- 59 -

7.4.21.1 Temperature Sensor Timing

Temp

Device

Temp

Margin

MR4

Trip Level

Temperature

Sensor

Update

Host

MR4 Read

MRR MR4=0x03

MR4=0x03

MR4=0x86

MR4=0x06

Readlnterval

MRR MR4=0x86

tTSI

Time

SysRespDelay

2°C

< (tTSI + Readlnterval + SysRespDelay)

Tem

pGra

dien

7.4.21.2 DQ Calibration

LPDDR2 device features a DQ Calibration function that outputs one of two predefined system timing calibration

patterns. A Mod

e Register Read to MR32 (Pattern “A”) or MR40 (Pattern “B”) will return the specified pattern on

D Q [ 0 ] a n d D Q [ 8 ] f o r x 1 6 d e v i c e s , a n d D Q [ 0 ] , D Q [ 8 ] , D Q [ 1 6 ] , a n d D Q [ 2 4 ] f o r x 3 2 d e v i c e s .

For x16 devices, DQ[7:1] and DQ[15:9] may optionally drive the same information as DQ[0] or may drive 0b during

the MRR burst. For x32 devices, DQ[7:1], DQ[15:9], DQ[23:17], and DQ[31:25] may optionally drive the same

information as DQ[0] or may drive 0b during the MRR burst.

For LPDDR2-S4 devices, MRR DQ Calibration commands may only occur in the Idle state.

Table of Data Calibration Pattern Description

Pattern

MR#

Bit Time 0 Bit Time 1 Bit Time 2 Bit Time 3

Description

Pattern A

MR32

Read to MR32 return DQ calibration pattern A

Pattern B

MR40

Read to MR40 return DQ calibration pattern B

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