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W97AH6KB Datasheet(PDF) 74 Page - Winbond

Part # W97AH6KB
Description  Four-bit prefetch DDR architecture
PDF  127 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W97AH6KB Datasheet(HTML) 74 Page - Winbond

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W97AH6KB / W97AH2KB
Publication Release Date: May 15, 2014
Revision: A01-001
- 74 -
Notes:
1.
All LPDDR2 commands are defined by states of CS_n, CA0, CA1, CA2, CA3, and CKE at the rising edge of the clock.
2.
For LPDDR2 SDRAM, Bank addresses BA0, BA1, BA2 (BA) determine which bank is to be operated upon.
3.
AP is significant only to SDRAM.
4.
AP “high” during a READ or WRITE command indicates that an auto-precharge will occur to the bank associated with the READ or WRITE
command.
5.
“X” means “H or L (but a defined logic level)”.
6.
Self refresh exit and Deep Power Down exit are asynchronous.
7.
VREF must be between 0 and VDDQ during Self Refresh and Deep Power Down operation.
8.
CAxr refers to command/address bit “x” on the rising edge of clock.
9.
CAxf refers to command/address bit “x” on the falling edge of clock.
10. CS_n and CKE are sampled at the rising edge of clock.
11. Per Bank Refresh is only allowed in devices with 8 banks.
12. The least-significant column address C0 is not transmitted on the CA bus, and is implied to be zero.
13.
AB “high”during Precharge command indicates that all bank Precharge will occur. In this case, Bank Address is do-not-care.
7.5.2
CKE Truth Table
Notes:
1.
“CKEn” is the logic state of CKE at clock rising edge n; “CKEn-1” was the state of CKE at the previous clock edge.
2.
“CS_n” is the logic state of CS_n at the clock rising edge n;
3.
“Current state” is the state of the LPDDR2 device immediately prior to clock edge n.
4.
“Command n” is the command registered at clock edge N, and “Operation n” is a result of “Command n”.
5.
All states and sequences not shown are illegal or reserved unless explicitly described elsewhere in this document.
6.
Power Down exit time (tXP) should elapse before a command other than NOP is issued.
7.
Self-Refresh exit time (tXSR) should elapse before a command other than NOP is issued.
8.
The Deep Power-Down exit procedure must be followed as discussed in the Deep Power-Down section of the Func tional Description.
9.
The clock must toggle at least once during the tXP period.
10. The clock must toggle at least once during the tXSR time.
11.
X’ means ‘Don’t care’.
12. Upon exiting Resetting Power Down, the device will return to the Idle state if tINIT5 has expired.
Device Current State
*3
CKEn-1
*1
CKEn
*1
CS_n
*2
Command n
*4
Operation n
*4
Device Next State
Notes
Active Power Down
L
L
X
X
Maintain Active Power Down
Active Power Down
L
H
H
NOP
Exit Active Power Down
Active
6, 9
Idle Power Down
L
L
X
X
Maintain Idle Power Down
Idle Power Down
L
H
H
NOP
Exit Idle Power Down
Idle
6, 9
Resetting Power Down
L
L
X
X
Maintain
Resetting Power Down
Resetting
Power Down
L
H
H
NOP
Exit Resetting Power Down
Idle or Resetting
6, 9, 12
Deep Power Down
L
L
X
X
Maintain
Deep Power Down
Deep Power Down
L
H
H
NOP
Exit Deep Power Down
Power On
8
Self Refresh
L
L
X
X
Maintain Self Refresh
Self Refresh
L
H
H
NOP
Exit Self Refresh
Idle
7, 10
Bank(s) Active
H
L
H
NOP
Enter
Active Power Down
Active Power Down
All Banks Idle
H
L
H
NOP
Enter
Idle Power Down
Idle Power Dow
H
L
L
Enter
Self Refresh
Enter
Self Refresh
Self Refresh
H
L
L
Deep Power Down
Enter
Deep Power Down
Deep Power Down
Resetting
H
L
H
NOP
Enter
Resetting Power Down
Resetting Power Down
Others states
H
H
Refer to the Command Truth Table



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