W97AH6KB datasheet(79/127 Pages) WINBOND

79 / 127 page

W97AH6KB / W97AH2KB

Publication Release Date: May 15, 2014

Revision: A01-001

- 79 -

ELECTRICAL CHARACTERISTIC

8.1

Absolute Maximum DC Ratings

Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and

functional operation of the device at these or any other conditions above those indicated in the operational sections

of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

reliability.

Parameter

Symbol

Min

Max

Units

Notes

VDD1 supply voltage relative to VSS

VDD1

-0.4

+2.3

VDD2 supply voltage relative to VSS

VDD2

-0.4

+1.6

VDDCA supply voltage relative to VSSCA

VDDCA

-0.4

+1.6

2, 4

VDDQ supply voltage relative to VSSQ

VDDQ

-0.4

+1.6

2, 3

Voltage on any ball relative to VSS

VIN, VOUT

-0.4

+1.6

Storage Temperature

TSTG

-55

+125

°C

Notes:

Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.

See “Power Ramp” in section 7.2.1 “Power Ramp and Device Initialization” for relationships between power supplies.

VREFDQ

≤ 0.6 x VDDQ; however, VREFDQ may be ≥ VDDQ provided that VREFDQ ≤ 300mV.

VREFCA

≤ 0.6 x VDDCA; however, VREFCA may be ≥ VDDCA provided that VREFCA ≤ 300mV.

Storage Temperature is the case surface temperature on the center/top side of the LPDDR2 device. For the measurement conditions, please

refer to JESD51-2 standard.

8.2

AC & DC Operating Conditions

Operation or timing that is not specified is illegal, and after such an event, in order to guarantee proper operation, the

LPDDR2 Device must be powered down and then restarted through the specialized initialization sequence before

normal operation can continue.

8.2.1

Recommended DC Operating Conditions

8.2.1.1

Recommended DC Operating Conditions

Symbol

LPDDR2-S4B

DRAM

Unit

Min

Typ

Max

VDD1

1.70

1.80

1.95

Core Power1

VDD2

1.14

1.20

1.30

Core Power2

VDDCA

1.14

1.20

1.30

Input Buffer Power

VDDQ

1.14

1.20

1.30

I/O Buffer Power

Note: VDD1 uses significantly less power than VDD2.

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