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W97AH6KB Datasheet(PDF) 18 Page - Winbond

Part # W97AH6KB
Description  Four-bit prefetch DDR architecture
PDF  127 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W97AH6KB Datasheet(HTML) 18 Page - Winbond

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W97AH6KB / W97AH2KB
Publication Release Date: May 15, 2014
Revision: A01-001
- 18 -
7.2.4
Initialization after Reset (without Power ramp)
If the RESET command is issued outside the power up initialization sequence, the reinitialization procedure shall
begin with step 3 (Td).
7.2.5
Power-off Sequence
The following sequence shall be used to power off the LPDDR2 device.
While removing power, CKE shall be held at a logic low level (
≤ 0.2 x VDDCA), all other inputs shall be between
VILmin and VIHmax. The LPDDR2 device will only guarantee that outputs are in a high impedance state while CKE is
held low.
DQ, DM, DQS_t and DQS_c voltage levels must be between VSSQ and VDDQ during power off sequence to avoid
latch-up. CK_t, CK_c, CS_n and CA input levels must be between VSSCA and VDDCA during power off sequence to
avoid latch-up.
Tx is the point where any power supply decreases under its minimum value specified in 8.2.1.1
“Recommended DC
Operating Conditions
” table.
Tz is the point where all power supplies are below 300 mV. After Tz, the device is powered off.
The time between Tx and Tz (tPOFF) shall be less than 2s.
The following conditions apply:
Between Tx and Tz, VDD1 must be greater than VDD2 - 200 mV.
Between Tx and Tz, VDD1 and VDD2 must be greater than VDDCA - 200 mV.
Between Tx and Tz, VDD1 and VDD2 must be greater than VDDQ - 200 mV.
Between Tx and Tz, VREF must always be less than all other supply voltages.
The voltage difference between any of VSS, VSSQ, and VSSCA pins may not exceed 100 mV.
For supply and reference voltage operating conditions, see 8.2.1.1
“Recommended DC Operating Conditions”
table.
7.2.6
Timing Parameters Power-Off
Symbol
Value
Unit
Comment
min
max
tPOFF
-
2
s
Maximum Power-Off Ramp Time
7.2.7
Uncontrolled Power-Off Sequence
The following sequence shall be used to power off the LPDDR2 device under uncontrolled condition.
Tx is the point where any power supply decreases under its minimum value specified in the DC operating condition
table. After turning off all power supplies, any power supply current capacity must be zero, except for any static
charge remaining in the system.
Tz is the point where all power supply first reaches 300 mV. After Tz, the device is powered off.
The time between Tx and Tz (tPOFF) shall be less than 2s. The relative levels between supply voltages are
uncontrolled during this period.
VDD1 and VDD2 shall decrease with a slope lower than 0.5 V/µS between Tx and Tz.
Uncontrolled power off sequence can be applied only up to 400 times in the life of the device.



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