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IMX93CEC Datasheet(PDF) 31 Page - NXP Semiconductors

Part # IMX93CEC
Description  i.MX 93 Applications Processors Data Sheet for Commercial Products
PDF  123 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IMX93CEC Datasheet(HTML) 31 Page - NXP Semiconductors

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Table 28. General purpose I/O (GPIO) AC parameters...continued
Symbol
Description
Min
Typ
Max
Unit
Condition
(1.62 V, 1.8 V, 1.98 V),
Drive strength X6
tF
TX fall time
349
—
506
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(1.62 V, 1.8 V, 1.98 V),
Drive strength X6
tR
TX rise time
4030
—
5790
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X1
tF
TX fall time
4410
—
6290
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X1
tR
TX rise time
1870
—
2950
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(1.62 V, 1.8 V, 1.98 V),
Drive strength X2
tF
TX fall time
1900
—
3310
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X2
tR
TX rise time
774
—
1930
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X3
tF
TX fall time
719
—
2070
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X3
tR
TX rise time
598
—
1360
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X4
tF
TX fall time
490
—
1590
ps
Slew rate FSEL1 =
11b, Fast Slew Rate
(3 V, 3.3 V, 3.465 V),
Drive strength X4
4.6.2 DDR I/O AC electrical characteristics
The DDR I/O pads support LPDDR4/LPDDR4X operational modes. The DDRC is compliant with JEDEC-compliant SDRAMs.
DDRC operation is contingent upon the board’s DDR design adherence to the DDR design and layout requirements stated in the
hardware development guide for the i.MX 93 application processor.
NXP Semiconductors
IMX93CEC
i.MX 93 Applications Processors Data Sheet for Commercial Products
IMX93CEC
All information provided in this document is subject to legal disclaimers.
© 2026 NXP B.V. All rights reserved.
Product data sheet
Rev. 7 — 12 February 2026
Document feedback
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