IMX93CEC datasheet(14/123 Pages) NXP

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Table 8. Absolute maximum ratings ...continued

Parameter description

Symbol

Min

Max

Unit

Notes

VDD_USB_1P8

-0.3

2.15

—

VDD_USB_3P3

-0.3

3.95

—

MIPI PHY supply voltage

VDD_MIPI_0P8

-0.3

1.15

—

VDD_MIPI_1P8

-0.3

2.15

—

LVDS PHY supply voltage

VDD_LVDS_1P8

-0.3

2.15

—

Analog core supply voltage

VDD_ANA_0P8

-0.3

1.15

—

VDD_ANAx_1P8

-0.3

2.15

[1]

Input/output voltage range

[2]

Vin/Vout

-0.3

NVCC_XXX +

0.3

—

Storage temperature range

TSTORAGE

-40

150

—

[1] VDD_ANAx_1P8 refers to VDD_ANA0_1P8, VDD_ANA1_1P8, and VDD_ANAVDET_1P8.

[2] Input and output voltages on the GPIO pins must remain within a minimum of –300 mV and a maximum of NVCC_XXX + 300 mV, where NVCC_XXX is the

operational GPIO supply voltage at the SoC. These limits include any DC offsets from the driving device as well as any AC transients—such as overshoot or

undershoot—occurring during signal switching.

Table 9. Electrostatic discharge and latch-up ratings

Parameter description

Rating

Reference

Comment

Electrostatic

Discharge (ESD)

Human Body Model (HBM)

±1000 V

JS-001

—

Charged Device Model (CDM)

±250 V

JS-002

—

Latch-up (LU)

Immunity level:

• Class II @ 95 °C

ambient temperature

JESD78

—

4.1.2 Thermal resistance

4.1.2.1 11 x 11 mm FCBGA package thermal characteristics

Table 10 displays the 11 x 11 mm FCBGA package thermal resistance data.

Table 10. 11 x 11 mm FCPBGA thermal resistance data

Rating

Board Type[1]

Symbol

Values

Unit

Junction to Ambient Thermal Resistance[2]

JESD51-9, 2s2p

RθJA

22.5

°C/W

Junction-to-Top of Package

JESD51-9, 2s2p

ΨJT

0.1

°C/W

Table continues on the next page...

NXP Semiconductors

IMX93CEC

i.MX 93 Applications Processors Data Sheet for Commercial Products

IMX93CEC

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 12 February 2026

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