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IMX93CEC Datasheet(PDF) 51 Page - NXP Semiconductors |
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IMX93CEC Datasheet(HTML) 51 Page - NXP Semiconductors |
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51 / 123 page ![]() 4.12.1.2 SD3.0/eMMC5.1 (dual data rate) AC timing Figure 23 depicts the timing of SD3.0/eMMC5.1 (DDR). Table 54 lists the SD3.0/eMMC5.1 (DDR) timing characteristics. Be aware that only DATA is sampled on both edges of the clock (not applicable to CMD). SD1 SD2 SD3 Output from eSDHCv3 to card Input from card to eSDHCv3 SDx_DATA[7:0] SDx_CLK SD4 SD2 ...... ...... SDx_DATA[7:0] Figure 23. eMMC5.1/SD3.0 (DDR) timing Table 54. SD3.0/eMMC5.1 (DDR) interface timing specification[1],[2] ID Parameter Symbols Min Max Unit Card Input Clock SD1 Clock Frequency (eMMC5.1 DDR) fPP 0 52 MHz SD1 Clock Frequency (SD3.0 DDR) fPP 0 50 MHz uSDHC Output / Card Inputs SD_CMD, SDx_DATAx (Reference to CLK) SD2 uSDHC Output Delay tOD 2.8 6.8 ns uSDHC Input / Card Outputs SD_CMD, SDx_DATAx (Reference to CLK) SD3 uSDHC Input Setup Time tISU 2.4 — ns SD4 uSDHC Input Hold Time tIH 1.5 — ns [1] Input timing assumes an input signal slew rate of 3 ns (20%/80%). [2] Output timing valid for maximum external load CL = 25 pF, which is assumed to be a 10 pF load at the end of a 50 ohm, unterminated, 5-inch microstrip trace on standard FR4 (3.3 pF/inch), (25 pF total with margin). For best signal integrity, the series resistance in the transmission line should be equal to the selected RDSON of the I/O pad output driver. 4.12.1.3 HS400 DDR AC timing Figure 24 depicts the timing of HS400 mode, Table 55 and Table 56 list the HS400 timing characteristics. Be aware that only data is sampled on both edges of the clock (not applicable to CMD). The CMD input/output timing for HS400 mode is the same as CMD input/output timing for SDR104 mode. Check SD5, SD6, and SD7 parameters in Table 59 and Table 60 for HS400 mode. NXP Semiconductors IMX93CEC i.MX 93 Applications Processors Data Sheet for Commercial Products IMX93CEC All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 7 — 12 February 2026 Document feedback 51 / 123 |
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