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OR4 Datasheet(PDF) 37 Page - Lattice Semiconductor |
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OR4 Datasheet(HTML) 37 Page - Lattice Semiconductor |
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37 / 152 page ![]() Lattice Semiconductor 37 Data Sheet May, 2006 ORCA Series 4 FPGAs Programmable Input/Output Cells (continued) I/O Banks and Groups Flexible I/O features allow the user to select the type of I/O needed to meet different high-speed interface requirements and these I/Os require different input ref- erences or supply voltages. The perimeter of the device is divided into eight banks of PIO buffers, as shown in Figure 23, and for each bank there is a separate VDDIO that supplies the correct input and output voltage for a particular standard. The user must supply the appropri- ate power supply to the VDDIO pin. Within a bank, sev- eral I/O standards may be mixed as long as they use a common VDDIO. The shaded section of the I/O banks in Figure 23 (banks 2, 3, and 4) are removed for FPSCs, to allow the embedded block to be placed on the side of the FPGA array. Bank 1 and bank 5 are also extended to the corners in FPSCs to incorporate more FPGA I/Os. Some interface standards require a specified threshold voltage known as VREF. To accommodate various VREF requirements, each bank is further divided into groups. In these modes, where a particular VREF is required, the device is automatically programmed to dedicate a VREF pin for each group of PIOs within a bank. The appropriate VREF voltage must be supplied by the user and connected to the VREF pin for each group. The VREF is dedicated exclusively to the group and cannot be intermixed within the group with other signaling requiring other VREF voltages. However, pins not requiring VREF can be mixed in the same group. When used to supply a reference voltage the VREF pad is no longer available to the user for general use. The VREF inputs should be well isolated to keep the reference voltage at a consistent level. Table 17. Compatible Mixed I/O Standards 0205(F). Figure 23. ORCA High-Speed I/O Banks Differential I/O (LVDS and LVPECL) Series 4 devices support differential input, output, and input/output capabilities through pairs of PIOs. The two standards supported are LVDS and LVPECL. The LVDS differential pair I/O standard allows for high- speed, low-voltage swing and low-power interfaces defined by industry standards: ANSI/TIA/EIA-644 and IEEE 1596.3 SSI-LVDS . The general purpose standard is supplied without the need for an input reference sup- ply and uses a low switching voltage which translates to low ac power dissipation. The ORCA LVDS I/O provides an integrated 100 Ω ter- mination resistor used to provide a differential voltage across the inputs of the receiver. The on-chip integra- tion provides termination of the LVDS receiver without the need of discrete external board resistors. The user has the programmable option to enable termination per receiver pair for point-to-point applications or in multi- point interfaces limit the use of termination to bussed pairs. If the user chooses to terminate any differential receiver, a single LVDS_R pin is dedicated to connect a single 100 Ω (± 1%) resistor to VSS which then enables an internal resistor matching circuit to provide a bal- ance 100 Ω (± 10%) termination across all process, voltage, and temperature. Experiments have also shown that enabling this 100 Ω matching resistor for LVDS outputs also improves performance. VDDIO Bank Voltage Compatible Standards 3.3 V LVTTL, SSTL3-I, SSTL3-II, GTL+, GTL, LVPECL, PECL 2.5 V LVCMOS2, SSTL2-I, SSTL2-II, LVDS 1.8 V LVCMOS18 1.5 V HSTL I, HSTL III, HSTL IV PLC ARRAY (TC) (TL) (BC) (BL) BANK 0 BANK 1 BANK 5 BANK 6 (TR) (BR) BANK 2 BANK 4 |
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