| Electronic Components Datasheet Search |
|
OR4 Datasheet(PDF) 40 Page - Lattice Semiconductor |
|
|
|||||||||||||||||||||||||||||
OR4 Datasheet(HTML) 40 Page - Lattice Semiconductor |
|
40 / 152 page ![]() 40 40 Lattice Semiconductor Data Sheet May, 2006 ORCA Series 4 FPGAs Special Function Blocks (continued) Start-Up Logic The start-up logic block can be configured to coordi- nate the relative timing of the release of GSRN, the activation of all user I/Os, and the assertion of the DONE signal at the end of configuration. If a start-up clock is used to time these events, the start-up clock can come from CCLK, or it can be routed into the start- up block using upper-left corner routing resources. Temperature Sensing The built –in temperature sensing diodes allow junction temperature to be measured during device operation. A physical pin (PTEMP) is dedicated for monitoring device junction temperature. PTEMP works by forcing a 10 μA current in the forward direction, and then mea- suring the resulting voltage. A 250 kΩ resistor tied to 3.3 V will approximate the needed 10 μA. The voltage decreases with increasing temperature at a rate of approximately –1.44 mV/°C. A typical device with an 85°C device temperature will measure about 640 mV. Boundary-Scan The IEEE standards 1149.1 and 1149.2 (IEEE Stan- dard test access port and boundary-scan architecture) are implemented in the ORCA series of FPGAs. It allows users to efficiently test the interconnection between integrated circuits on a PCB as well as test the integrated circuit itself. The IEEE 1149 standard is a well-defined protocol that ensures interoperability among boundary-scan (BSCAN) equipped devices from different vendors. Series 4 FPGAs are also compliant to IEEE standard 1532/D1. This standard for boundary-scan based in- system configuration of programmable devices pro- vides a standardized programming access and meth- odology for FPGAs. A device, or set of devices, implementing this standard may be programmed, read back, erased verified, singly or concurrently, with a standard set of resources. The IEEE 1149 standards define a test access port (TAP) that consists of a four-pin interface with an optional reset pin for boundary-scan testing of inte- grated circuits in a system. The ORCA Series FPGA provides four interface pins: test data in (TDI), test mode select (TMS), test clock (TCK), and test data out (TDO). The PRGM pin used to reconfigure the device also resets the boundary-scan logic. The user test host serially loads test commands and test data into the FPGA through these pins to drive out- puts and examine inputs. In the configuration shown in Figure 26, where boundary-scan is used to test ICs, test data is transmitted serially into TDI of the first BSCAN device (U1), through TDO/TDI connections between BSCAN devices (U2 and U3), and out TDO of the last BSCAN device (U4). In this configuration, the TMS and TCK signals are routed to all boundary-scan ICs in parallel so that all boundary-scan components operate in the same state. In other configurations, mul- tiple scan paths are used instead of a single ring. When multiple scan paths are used, each ring is indepen- dently controlled by its own TMS and TCK signals. Figure 26 provides a system interface for components used in the boundary-scan testing of PCBs. The three major components shown are the test host, boundary- scan support circuit, and the devices under test (DUTs). The DUTs shown here are ORCA Series FPGAs with dedicated boundary-scan circuitry. The test host is normally one of the following: automatic test equipment (ATE), a workstation, a PC, or a micropro- cessor. 5-5972(F) Key:BSC = boundary-scan cell, BDC = bidirectional data cell, and DCC = data control cell. Figure 25. Printed-Circuit Board with Boundary-Scan Circuitry INSTRUCTION TDO REGISTER BYPASS REGISTER TCK TMS TDI SCAN OUT SCAN IN SCAN OUT SCAN IN SCAN IN SCAN OUT BSC BDC DCC SCAN OUT SCAN IN TAPC p_in p_in p_out p_in p_ts p_out p_ts p_in p_out p_ts p_out p_ts PL[ij] PT[ij] PR[ij] PB[ij] BDC DCC PLC ARRAY BDC DCC BDC DCC BSC BSC BSC SEE ENLARGED VEIW BELOW TMS TDI TCK TDO TMS TDI TCK TDO TMS TDI TCK TDO TMS TDI TCK TDO U1 U2 U3 U4 TDI TCK TDO TMS net a net b net c S |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |