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OR4 Datasheet(PDF) 43 Page - Lattice Semiconductor

Part # OR4
Description  ORCASeries 4 FPGAs
PDF  152 Pages
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

OR4 Datasheet(HTML) 43 Page - Lattice Semiconductor

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Data Sheet
May, 2006
Lattice Semiconductor
43
ORCA Series 4 FPGAs
Special Function Blocks (continued)
ISC_READ is similar to the ORCA RAM_Read instruction which allows the user to readback the configuration RAM
contents serially out on TDO. Both must monitor the PDONE signal to determine weather or not configuration is
completed. ISC_READ used a 1-bit register to synchronously readback data coming from the configuration mem-
ory. The readback data is clocked into the ISC_READ data register and then clocked out TDO on the falling edge or
TCK.
Table 19. Series 4E Boundary-Scan Vendor-ID Codes
* PLC array size of FPGA, reverse bit order.
Note: Table assumes version 0.
Device
Version (4 bit)
Part* (10 bit)
Family (6 bit)
Manufacturer (11 bit)
LSB (1 bit)
OR4E02
0000
0011100000
001000
00000011101
1
OR4E04
0000
0001010000
001000
00000011101
1
OR4E06
0000
0000110000
001000
00000011101
1
ORCA Boundary-Scan Circuitry
The ORCA Series boundary-scan circuitry includes a
test access port controller (TAPC), instruction register
(IR), boundary-scan register (BSR), and bypass regis-
ter. It also includes circuitry to support the four pre-
defined instructions.
Figure 27 shows a functional diagram of the boundary-
scan circuitry that is implemented in the ORCA Series.
The input pins’ (TMS, TCK, and TDI) locations vary
depending on the part, and the output pin is the dedi-
cated TDO/RD_DATA output pad. Test data in (TDI) is
the serial input data. Test mode select (TMS) controls
the boundary-scan test access port controller (TAPC).
Test clock (TCK) is the test clock on the board.
The BSR is a series connection of boundary-scan cells
(BSCs) around the periphery of the IC. Each I/O pad on
the FPGA, except for CCLK, DONE, and the boundary-
scan pins (TCK, TDI, TMS, and TDO), is included in the
BSR. The first BSC in the BSR (connected to TDI) is
located in the first PIO I/O pad on the left of the top side
of the FPGA (PTA PIO). The BSR proceeds clockwise
around the top, right, bottom, and left sides of the array.
The last BSC in the BSR (connected to TDO) is located
on the top of the left side of the array (PL1D).
The bypass instruction uses a single FF, which resyn-
chronizes test data that is not part of the current scan
operation. In a bypass instruction, test data received on
TDI is shifted out of the bypass register to TDO. Since
the BSR (which requires a two FF delay for each pad)
is bypassed, test throughput is increased when devices
that are not part of a test operation are bypassed.
The boundary-scan logic is enabled before and during
configuration. After configuration, a configuration
option determines whether or not boundary-scan logic
is used.
The 32-bit boundary-scan identification register con-
tains the manufacturer’s ID number, unique part num-
ber, and version (as described earlier). The
identification register is the default source for data on
TDO after RESET if the TAP controller selects the shift-
data-register (SHIFT-DR) instruction. If boundary scan
is not used, TMS, TDI, and TCK become user I/Os, and
TDO is 3-stated or used in the readback operation.



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