78M6612-IMSLASHFSLASHP datasheet(45/111 Pages) TERIDIAN

45 / 111 page

DS_6612_001

78M6612 Data Sheet

Rev. 1.2

Table 40: Selectable Controls using the DIO_DIR Bits

DIO_R Value

Resource Selected for DIO Pin

NONE

Reserved

T0 (counter0 clock)

T1 (counter1 clock)

High priority I/O interrupt (INT0 rising)

Low priority I/O interrupt (INT1 rising)

High priority I/O interrupt (INT0 falling)

Low priority I/O interrupt (INT1 falling)

1.5.8

LCD Drivers

The device in the 68-pin QFN package contains 20 dedicated LCD segment drivers in addition to the 18

multi-use pins described above. Thus, the device is capable of driving between 80 to 152 pixels of LCD

display with 25% duty cycle (or 60 to 114 pixels with 33% duty cycle). At eight pixels per digit, this

corresponds to 10 to 19 digits.

The device in the 64-pin LQFP package contains 18 dedicated LCD segment drivers in addition to the 17

multi-use pins described above. Thus, the device is capable of driving between 72 to 140 pixels of LCD

display with 25% duty cycle (or 60 to 105 pixels with 33% duty cycle). At eight pixels per digit, this

corresponds to 9 to 17 digits.

The LCD drivers are grouped into four commons and up to 38 segment drivers (68-pin package), or 4

commons and 35 segment drivers (64-pin package). The LCD interface is flexible and can drive either

digit segments or enunciator symbols.

Segment drivers SEG18 and SEG19 can be configured to blink at either 0.5 Hz or 1 Hz. The blink rate

is controlled by LCD_Y. There can be up to four pixels/segments connected to each of these drivers.

LCD_BLKMAP18[3:0] and LCD_BLKMAP19[3:0] identify which pixels, if any, are to blink.

LCD interface memory is powered by the non-volatile supply. The bits of the LCD memory

are preserved in LCD and SLEEP modes, even if their pin is not configured as SEG. In this

case, they can be useful as general- purpose non-volatile storage.

1.5.9

Battery Monitor

The battery voltage is measured by the ADC during alternative MUX frames if the BME (Battery Measure

Enable) bit is set. While BME is set, an on-chip 45 k

Ω load resistor is applied to the battery and a scaled

fraction of the battery voltage is applied to the ADC input. After each alternative MUX frame, the result of

the ADC conversion is available at CE DRAM address 0x07. BME is ignored and assumed zero when

system power is not available. See Section 5.4.4 Battery Monitor for details regarding the ADC LSB size

and the conversion accuracy.

78M6612-IM/F/P Datasheet(PDF) 45 Page - Teridian Semiconductor Corporation

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