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78M6612-IM/F/P Datasheet(PDF) 8 Page - Teridian Semiconductor Corporation |
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78M6612-IM/F/P Datasheet(HTML) 8 Page - Teridian Semiconductor Corporation |
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8 / 111 page ![]() 78M6612 Data Sheet DS_6612_001 8 Rev. 1.2 1 Hardware Description 1.1 Hardware Overview The Teridian 78M6612 single-chip measurement unit integrates all primary functional blocks required to implement a solid-state electricity Power and Energy Measurement function. Included on chips are: • An analog front end (AFE) • An independent digital computation engine (CE) • An 8051-compatible microprocessor (MPU) which executes one instruction per clock cycle (80515) • A voltage reference • A temperature sensor • LCD drivers • RAM and Flash memory • A real time clock (RTC) • A variety of I/O pins Various current sensor technologies are supported including Current Transformers (CT), and Resistive Shunts. In a typical application, the 32-bit compute engine (CE) of the 78M6612 sequentially processes the samples from the voltage inputs on pins IA, VA, IB, VB and performs calculations to measure active energy (Wh), reactive energy (VARh), A 2h, and V2 One of the two internal UARTs is adapted to support an Infrared LED with internal drive and sense configuration, and can also function as a standard UART. The optical output can be modulated at 38 kHz. A block diagram of the IC is shown in h for four-quadrant measurement. These measurements are then accessed by the MPU, processed further and output using the peripheral devices available to the MPU. In addition to advanced measurement functions, the real time clock function allows the 78M6612 to record time of use (TOU) measurement information for multi-rate applications and to time-stamp events. Measurements can be displayed on 3.3 V LCDs if desired. Flexible mapping of LCD display segments will facilitate utilization of existing custom LCDs. Design trade-off between number of LCD segments vs. DIO pins can be implemented in software to accommodate various requirements. In addition to the temperature-trimmed ultra-precision voltage reference, the on-chip digital temperature compensation mechanism includes a temperature sensor and associated controls for correction of unwanted temperature effects on measurement and RTC accuracy, e.g. to meet the requirements of ANSI and IEC standards. Temperature dependent external components such as crystal oscillator, current transformers (CTs), and their corresponding signal conditioning circuits can be characterized and their correction factors can be programmed to produce measurements with exceptional accuracy over the industrial temperature range, if desired. Figure 1. A detailed description of various functional blocks follows. |
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