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DM504 Datasheet(PDF) 198 Page - Texas Instruments

Part # DM504
Description  SoC for Vision Analytics 12mm Package (ABE) Silicon Revision 2.0
PDF  211 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

DM504 Datasheet(HTML) 198 Page - Texas Instruments

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Device
rtc_osc_xo
rtc_osc_xi_clkin32
C
f1
Crystal
Rd
C
f2
(Optional)
SPRS91v_PCB_CLK_OSC_02
198
DM504
SPRS977A – NOVEMBER 2016 – REVISED JANUARY 2017
www.ti.com
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Applications, Implementation, and Layout
Copyright © 2016–2017, Texas Instruments Incorporated
Table 7-10. Length Mismatch Guidelines for CSI-2 (1.5 Gbps)
PARAMETER
TYPICAL VALUE
UNIT
Operating speed
1500
Mbps
UI (bit time)
667
ps
Intralane skew
Have to satisfy mode-conversion S parameters(1)
Interlane skew (UI / 50)
13.34
ps
(1) sdc12, scd21, scd12, sdc21, scd11, sdc11, scd22, and sdc22
7.5.2.1.3 Frequency-domain Specification Guidelines
After the PCB design is finished, the S-parameters of the PCB differential lines will be extracted with a 3D
Maxwell Equation Solver such as the high-frequency structure simulator (HFSS) or equivalent, and
compared to the frequency-domain specification as defined in the section 7 of the MIPI Alliance
Specification for D-PHY Version v1-01-00_r0-03.
If the PCB lines satisfy the frequency-domain specification, the design is finished. Otherwise, the design
needs to be improved.
7.6
Clock Routing Guidelines
7.6.1
Oscillator Ground Connection
Although the impedance of a ground plane is low it is, of course, not zero. Therefore, any noise current in
the ground plane causes a voltage drop in the ground. Figure 7-21 shows the grounding scheme for slow
(low frequency) clock generated from the internal oscillator.
Figure 7-21. Grounding Scheme for Low-Frequency Clock
Figure 7-22 shows the grounding scheme for high-frequency clock.



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