ADC14X250 datasheet(6/69 Pages) TI1

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ADC14X250

SLASE49 – DECEMBER 2015

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

VCM refers to the voltage bias present at the VCM output. The Absolute Maximum Rating for the VIN+ and VIN– inputs may extend

down to –0.3V for the purpose of the initial power-up transient only. Forcing these pins to a voltage lower than VCM – 0.75 for an

extended time may reduce the operating lifetime of the device.

(3)

When the input voltage at any pin exceeds the VA3.0 power supply (that is VIN > VA3.0 or VIN < AGND) the current at that pin should be

limited to ±5 mA. The ±50-mA maximum package input current rating limits the number of pins that can safely exceed the power

supplies with an input current of ±5 mA to 10 pins.

(4)

Prolonged use at this temperature may increase the device failure-in-time (FIT) rate.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage

VA3.0

–0.3

4.2

VA1.8

–0.3

2.35

VA1.2

–0.3

1.55

Voltage at:

VIN+, VIN–

VCM – 0.75

(2)

VCM + 0.75

VCM

–0.3

VA3.0 + 0.3, not to exceed 4.2 V

SCLK, SDI, CSb

–0.3

VA3.0 + 0.3, not to exceed 4.2 V

SDO

–0.3

VSPI + 0.3, not to exceed 4.2 V

CLKIN+, CLKIN–, SYSREF+, SYSREF–

–0.3

1.55

SYNC+, SYNC–

–0.3

VBP2.5 + 0.3

BP2.5

–0.3

3.2

SO+, SO–

–0.3

VBP2.5 + 0.3

Input current at any pin(3)

Operating junction temperature(4)

125

°C

Tstg

Storage temperature range

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

Charged device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

(1)

This device may be operated above the maximum ambient temperature (TA-MAX) up to the value of TP-MAX as long as the maximum

temperature at the device's footprint thermal pad on the printed circuit board remains less than TP-MAX.

(2)

The recommended maximum operating junction temperature assumes the junction to package bottom thermal resistance, RθJC(bottom) =

1.1°C/W, the thermal resistance of the device thermal pad connection to the PCB footprint is negligible, and the recommended

maximum temperature at the PCB footprint thermal pad, TP-MAX, is satisfied.

6.3 Recommended Operating Conditions

Operation of the device beyond the recommended operating ratings is not recommended as it may degrade the device

lifetime.

MIN

MAX

UNIT

TA-MIN

Specified temperature minimum, ambient air.

–40

°C

TA-MAX Specified temperature maximum, ambient air.

(1)

°C

TP-MAX Specified temperature maximum, measured at the device's footprint thermal

pad on the printed circuit board.

105

°C

Operating junction temperature(2)

106

°C

ADC14X250 Datasheet(PDF) 6 Page - Texas Instruments

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