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ADC14X250 Datasheet(PDF) 61 Page - Texas Instruments |
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ADC14X250 Datasheet(HTML) 61 Page - Texas Instruments |
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61 / 69 page ![]() 61 ADC14X250 www.ti.com SLASE49 – DECEMBER 2015 Product Folder Links: ADC14X250 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Layout Guidelines (continued) 11.1.1 Layout Example Figure 60. Example Layout 11.1.2 Thermal Considerations The exposed thermal pad of the ADC14X250 device draws heat from the silicon down into the PCB to prevent overheating and must attach to the landing pad with a quality solder connection to maximize thermal conductivity. Overly hot operating temperatures may be alleviated further by increasing the PCB size, filling surface layers with ground planes to increase heat radiation, or using a thermally conductive connection between the package top and a heat sink. |
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