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DP8344 Datasheet(PDF) 45 Page - National Semiconductor (TI) |
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DP8344 Datasheet(HTML) 45 Page - National Semiconductor (TI) |
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45 / 184 page ![]() 20 CPU Description (Continued) A call to the interrupt address is generated when an inter- rupt is detected by the CPU The address for each interrupt is constructed by concatenating the Interrupt Base Register IBR contents with the individual interrupt code as shown in Table 2-28 There is room between the interrupt address- es for a maximum of four instruction words TABLE 2-28 Interrupt Vector Generation Interrupt Code NMI 111 RFF DA RA 001 TFE 010 LTA 011 BIRQ 100 TO 101 Interrupt Vector IBR Contents 0 0 0 Code 0 0 15 8 5 2 0 Interrupts are sampled by each falling edge of the CPU clock with the last falling edge prior to the start of the next instruction determining whether an interrupt will be process- ed The timing of a typical interrupt event is shown in Figure 2-34 The interrupt occurs during the current instruction and is sampled by the falling edge of the CPU clock The next instruction is not operated on and its address is stored in the internal address stack along with GIE the ALU flags and the register bank positions The address stack is twelve words deep A two T-state internal call is now executed in place of the non-executed instruction This call will cause a branch to the interrupt address that is generated in the first half of T-state T1 Also GIE is cleared at the end of the first half of T-state T1 The internal call to the interrupt ad- dress is subject to instruction wait states as configured in DCR 224 Oscillator The crystal oscillator is an on-chip amplifier which may be used with an external crystal to generate accurate CPU and transceiver clocks The input to this amplifier is X1 pin 33 The output of the amplifier is X2 pin 34 When X1 and X2 are connected to a crystal and external capacitors (Figure 2-35) the combined circuit forms a Pierce crystal oscillator with the crystal operating at parallel resonance Crystals that oscillate over the frequency range of 2 MHz to 20 MHz may be used The recommended crystal parameters for op- eration with the oscillator are given in Table 2-29 The exter- nal capacitor values should be chosen to provide the manu- facturer’s specified load capacitance for the crystal when combined with the parasitic capacitance of the trace sock- et and package As an example a crystal with a specified load capacitance of 20 pF used in a circuit with 13 pF per pin parasitic capacitance will require external capacitor val- ues of 27 pF each This provides an equivalent capacitance of 40 pF on each side of the crystal and has a 20 pF series equivalent value across the crystal As an alternative to the crystal oscillator an external clock source may be used In this case the external clock source should be connected to X1 and no external circuitry should be connected to X2 (Figure 2-36) The DP8344 can supply a clock source equal in frequency to the crystal oscillator or external clock source to other circuitry via pin 35 the CLK- OUT output This output is a buffered version of the signal at X1 TABLE 2-29 Recommended Crystal Parameters AT Cut Parallel Resonant Fundamental Mode Load Capacitor e 20 pF Series Resistance k 20X Frequency Tolerance 0005% at 25 C Stability 001% 0 –70 C Drive Level 05 mW Typical TLF9336 – F7 FIGURE 2-34 Interrupt Timing 45 |
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