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FS6500 Datasheet(PDF) 22 Page - NXP Semiconductors

Part # FS6500
Description  Safety power system basis chip with CAN FD and LIN transceivers
PDF  153 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

FS6500 Datasheet(HTML) 22 Page - NXP Semiconductors

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NXP Semiconductors
FS6500-FS4500-ASILD
Safety power system basis chip with CAN FD and LIN transceivers
TA = –40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 36 V, unless otherwise specified. All voltages referenced to ground.
When 28 V < VSUP < 36 V, thermal dissipation must be considered (see Figure 32).
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
VHYST
VHYST = VTH_REC – VTH_DOM
—
—
0.175
× VSUP
V
IBUS_NO_GND
Ground disconnection. GND = VSUP, 0 V < VBUS < 18 V, VBAT =
12 V. Loss of local GND does not affect communication in the
remaining network
–1.0
—
1.0
mA
[16]
IBUS_NO_BAT
VBAT disconnection. VSUP = GND, 0 V < VBUS < 18 V. Node
sustains the current which can flow under this condition. BUS
remains operational.
—
—
30
µA
LINTSD
LIN thermal shutdown
150
175
—
°C
[5]
LINTSD_HYST
LIN thermal shutdown hysteresis
20
°C
CLIN
LIN internal capacitor
—
—
10
pF
[5]
Table 5. Static electrical characteristics ...continued
[1]
Long duration timer and VKAM disable.
[2]
VSUP_UV_L_B = VPRE_UV_4P3 + RDSON_PRE × IPRE.
[3]
VSUP min to guarantee VKAM and main logic supply in LPOFF.
[4]
Guaranteed by characterization.
[5]
Guaranteed by design.
[6]
External PNP gain within 150 to 450.
[7]
Valid for VSUP3 ≥ IO_5.
[8]
If a higher resistor value than recommended is used, the accuracy degrades.
[9]
Wide range accuracy for input voltage from 9.0 V to 19 V.
[10] Guaranteed by design and characterization.
[11] VBAT is the voltage at the input of the control unit.
[12] Current flowing inside the pin. A transceiver must be capable to sink at least 40 mA.
[13] VBAT: voltage across the battery connectors of the vehicle. VGND_ECU: voltage on the local ECU ground connector with respect to battery ground of the
vehicle (VGND_BATTERY).
[14] This constraint refers to duty cycle D1 and D2 only.
[15] VTH_DOM: receiver threshold of the recessive to dominant LIN bus edge. VTH_REC receiver threshold of the dominant to recessive LIN bus edge.
[16] VSUP is the voltage at the input of the device (different from VBAT when a reverse current protection diode is implemented.
10 Dynamic electrical characteristics
TA = –40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 36 V, unless otherwise specified. All voltages referenced to ground.
When 28 V < VSUP < 36 V, thermal dissipation must be considered (see Figure 32).
Symbol
Parameter
Min.
Typ.
Max.
Unit
Notes
Digital interface timing
fSPI
SPI operation frequency (50 % DC)
0.5
—
8.0
MHz
tMISO_TRANS
MISO transition speed, 20 – 80 %
• VDDIO = 5.0 V, CLOAD = 50 pF
• VDDIO = 5.0 V, CLOAD = 150 pF
 
5.0
5.0
 
—
—
 
30
50
 
ns
tCLH
Minimum time SCLK = HIGH
62
—
—
ns
tCLL
Minimum time SCLK = LOW
62
—
—
ns
tPCLD
Propagation delay (SCLK to data at 10 % of MISO rising edge)
—
—
30
ns
tCSDV
NCS = low to data at MISO active
—
—
75
ns
tSCLCH
SCLK low before NCS low (setup time SCLK to NCS change H/
L)
75
—
—
ns
tHCLCL
SCLK change L/H after NCS = low
75
—
—
ns
tSCLD
SDI input setup time (SCLK change H/L after MOSI data valid)
40
—
—
ns
tHCLD
SDI input hold time (MOSI data hold after SCLK change H/L)
40
—
—
ns
Table 6. Dynamic electrical characteristics
FS6500-FS4500-ASILD
All information provided in this document is subject to legal disclaimers.
© 2024 NXP B.V. All rights reserved.
Product data sheet
Rev. 8 — 5 August 2024
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