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TPS62870 Datasheet(PDF) 32 Page - Texas Instruments

Part # TPS62870
Description  TPS6287x 2.7V to 6V Input, 6A, 9A, 12A, 15A, Fast Transient Stackable Synchronous Step-Down Converters With I2C Interface and Remote Sense
PDF  66 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TPS62870 Datasheet(HTML) 32 Page - Texas Instruments

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• All the devices in the stack share a common power-good signal, which must be pulled up to a logic high level
above Vsub(IH_PG). The PG pins must be connected and pulled up, even if the PG output is not used.
• All the devices in the stack share a common compensation signal.
• All secondary devices must connect a 47kΩ resistor between the SYNC_OUT pin and ground.
• The remote sense pins (VOSNS and GOSNS) of each device must be connected (do not leave these pins
floating).
• Each device must be configured for the same switching frequency.
• The primary device must be configured for forced PWM operation (secondary devices are automatically
configured for forced PWM operation).
• A stacked configuration can support synchronization to an external clock or spread-spectrum clocking.
• Only the VSEL pin of the primary device is used to set the default output voltage. The VSEL pin of secondary
devices is not used and must be connected to ground.
• The SDA and SCL pins of secondary devices are not used and must be connected to ground.
• A stacked configuration uses a daisy-chained clocking signal, in which each device switches with a phase
offset of approximately 140° relative to the adjacent devices in the daisy-chain. To daisy-chain the clocking
signal, connect the SYNC_OUT pin of the primary device to the MODE/SYNC pin of the first secondary
device. Connect the SYNC_OUT pin of the first secondary device to the MODE/SYNC pin of the second
secondary device. Continue this connection scheme for all devices in the stack, to daisy-chain them together.
• Hiccup overcurrent protection must not be used in a stacked configuration.
In a stacked configuration, the common enable signal also acts as a SYSTEM_READY signal (see Section
7.3.3). Each device in the stack can pull the EN pin low during device start-up or when a fault occurs. Thus, the
stack is only enabled when all devices have completed the start-up sequence and are fault-free. A fault in any
one device disables the whole stack for as long as the fault condition exists.
During start-up, the primary converter pulls the COMP pin low for as long as the enable signal
(SYSTEM_READY) is low. When the enable signal goes high, the primary device actively controls the COMP
pin and all converters in the stack follow the COMP voltage. During start-up, each device in the stack pulls
the PG pin low while the device initializes. When initialization is complete, each secondary device in the stack
sets the PG pin to a high impedance and the primary device alone controls the state of the PG signal. The PG
pin goes high when the stack has completed the start-up ramp and the output voltage is within specification.
The secondary converters in the stack detect the rising edge of the power-good signal and switch from DCM
operation to CCM operation. After the stack has successfully started up, the primary device controls the power-
good signal in the normal way. In a stacked configuration, there are some faults that only affect individual
devices, and other faults that affect all devices. For example, if one device enters current limit, only that device
is affected. But a thermal shutdown or undervoltage lockout event in one device disables all devices through the
shared enable (SYSTEM_READY) signal.
Functionality During Stacked Operation
Some device features are not available during stacked operation, or are only available in the primary converter.
Table 7-8 summarizes the available functionality during stacked operation.
Table 7-8. Functionality During Stacked Operation
FUNCTION
PRIMARY DEVICE
SECONDARY DEVICE
REMARK
UVLO
Yes
Yes
Common enable signal
OVLO
Yes
Yes
Common enable signal
OCP – Current Limit
Yes
Yes
Individual
OCP – Hiccup OCP
No
No
Do not use during stacked
operation.
Thermal Shutdown
Yes
Yes
Common enable signal
Power-Good (Window
Comparator)
Yes
No
Primary device only
I2C Interface
Yes
No
Primary device only
DVS
Through I2C
No
Voltage loop controlled by primary
device only
TPS62870, TPS62871, TPS62872, TPS62873
SLVSGC5E – JANUARY 2023 – REVISED OCTOBER 2025
www.ti.com
32
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Product Folder Links: TPS62870 TPS62871 TPS62872 TPS62873



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