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TPS62870 Datasheet(PDF) 63 Page - Texas Instruments |
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TPS62870 Datasheet(HTML) 63 Page - Texas Instruments |
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63 / 66 page ![]() PACKAGE OUTLINE 4226093/E 09/2022 www.ti.com VQFN-FCRLF - 1.05 mm max height PLASTIC QUAD FLAT PACK- NO LEAD RXS0016A A 0.08 C 3.65 3.45 1.05 0.95 SEATING PLANE PIN 1 INDEX AREA C (0.2) TYP 0.00 -0.01 1 0.1 C A B 0.05 C PIN 1 ID (45° X 0.35) B 2.65 2.45 16X 0.3 0.2 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance. 20X 0.5 2X 3 24X (0.18) 2X 2 11X 0.5 0.3 0.2 MIN. 2.25±0.1 1.25±0.1 SYMM ℄ SYMM ℄ 3X 0.275 6 7 8 13 16 17 SECTION A-A TYPICAL 0.1 MIN (0.1) A A |
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