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AD9213 Datasheet(PDF) 57 Page - Analog Devices

Part # AD9213
Description  12-Bit, 6 GSPS/10.25 GSPS, JESD204B, RF Analog-to-Digital Converter
PDF  110 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD9213 Datasheet(HTML) 57 Page - Analog Devices

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Data Sheet
AD9213
Rev. A | Page 57 of 110
8-BIT/10-BIT
ENCODER
SERDOUT0±
SERDOUT15±
TAIL BITS
0x503[6]
SERIALIZER
ADC
SYMBOL0
SYMBOL1
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
MSB
0x505 BITS[5:4] = 00
0x505 BITS[5:4] = 10
0x505 BITS[5:4] = 01
LSB
C2
C1
C0
CONTROL BITS
JESD204B SAMPLE
CONSTRUCTION
JESD204B
LONG
TRANSPORT
TEST PATTERN
0x503 BITS
FRAME
CONSTRUCTION
JESD204B
INTERFACE
TEST
PATTERNS
0x505 BITS[5:0]
JESD204B
DATA LINK
LAYER TEST
PATTERNS
0x506 BITS[2:0]
SCRAMBLER
1 + x14 + x15
(OPTIONAL)
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
C2
C1
C0
T
MSB
LSB
S7
S6
S5
S4
S3
S2
S1
S0
S7
S6
S5
S4
S3
S2
S1
S0
MSB
LSB
a b c d e f g h i j
a b c d e f g h i j
a b
i j a b
i j
Figure 115. ADC Output Datapath Showing Data Framing (Conceptual Diagram)
TRANSPORT
LAYER
PHYSICAL
LAYER
DATA LINK
LAYER
Tx
OUTPUT
SAMPLE
CONSTRUCTION
FRAME
CONSTRUCTION
SCRAMBLER
ALIGNMENT
CHARACTER
GENERATION
8-BIT/10-BIT
ENCODER
CROSSBAR
MUX
SERIALIZER
PROCESSED
SAMPLES
FROM ADC
SYSREF_x
SYNCINB_x
Figure 116. Data Flow
FUNCTIONAL OVERVIEW
The block diagram in Figure 116 shows the flow of data through
the JESD204B hardware from the sample input to the physical
output. The processing can be divided into layers that are
derived from the open source initiative (OSI) model widely
used to describe the abstraction layers of communications
systems. These layers are the transport layer, data link layer,
and physical layer (serializer and output driver).
Transport Layer
The transport layer handles packing the data (consisting of
samples and optional control bits) into JESD204B frames that
are mapped to 8-bit octets. These octets are sent to the data link
layer. The transport layer mapping is controlled by rules derived
from the link parameters. Tail bits are added to fill gaps where
required.
The following equation can be used to determine the number of
tail bits within a sample (JESD204B word):
T = N΄ − N − CS
Data Link Layer
The data link layer is responsible for the low level functions
of passing data across the link. These include optionally
scrambling the data, inserting control characters for multichip
synchronization/lane alignment/monitoring, and encoding
8-bit octets into 10-bit symbols. The data link layer is also
responsible for sending the initial lane alignment sequence
(ILAS), which contains the link configuration data used by the
receiver to verify the settings in the transport layer.
Physical Layer
The physical layer consists of the high speed circuitry clocked at
the serial clock rate. In this layer, parallel data is converted into
one through sixteen lanes of high speed differential serial data.
JESD204B LINK ESTABLISHMENT
The AD9213 JESD204B transmitter interface operates in
Subclass 1 as defined in the JEDEC Standard 204B (July 2011
specification). The link establishment process is divided into the
following steps: code group synchronization and SYNCINB_x,
initial lane alignment sequence, and user data and error correction.
Code Group Synchronization (CGS) and SYNCINB_x
The CGS is the process by which the JESD204B receiver finds
the boundaries between the 10-bit symbols in the stream of
data. During the CGS phase, the JESD204B transmit block
transmits /K28.5/ characters. The receiver must locate /K28.5/
characters in its input data stream using clock and data recovery
(CDR) techniques.
The receiver issues a synchronization request by asserting the
SYNCINB_x pin of the AD9213 low. The JESD204B transmitter
then begins sending /K/ characters. When the receiver has
synchronized, it waits for the correct reception of at least four
consecutive /K/ symbols. It then deasserts the SYNCINB_x. The
AD9213 then transmits an ILAS on the following LMFC
boundary.
For more information on the code group synchronization phase,
refer to the JEDEC Standard JESD204B, July 2011, Section 5.3.3.1.



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