AD9213 datasheet(10/110 Pages) AD

10 / 110 page

AD9213

Data Sheet

Rev. A | Page 10 of 110

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

Supply Pins

BVDD2 to AGND

2.2 V

BVNN1 to AGND

−1.1 V

AVNN1 to GND

−1.1 V

AVDD to AGND

1.1 V

CLKVDD_LF to AGND

1.1 V

PLLVDD2 to AGND

2.2 V

AVDDFS8 to AVSSFS8

1.1 V

FVDD to AGND

1.1 V

VDD_NVG to VSS_NVG

1.1 V

RVDD2 to AGND

2.2 V

SVDD2 to DGND

2.2 V

DVDD to DGND

1.1 V

JVTT to JGND

1.1 V

JVDD to JGND

1.1 V

JVDD2 to JGND

2.2 V

TMU_AVDD2 to AGND

2.2 V

TMU_DVDD1 to AGND

1.1 V

GND Pins

AVSSFS8 to DGND

−0.3 V to +0.3 V

VSS_NVG to DGND

−0.3 V to +0.3 V

AGND to DGND

−0.3 V to +0.3 V

AGND to JGND

−0.3 V to +0.3 V

DGND to JGND

−0.3 V to +0.3 V

Input/Output Pins

VIN_x to AGND

−0.125 V to AVDD + 0.150 V

CLK_x to AGND

AGND − 0.3 V to

CLKVDD_LF + 0.3 V

CSB, RSTB, PDWN, SCLK, FD,

GPIO[x], SDIO to DGND

DGND − 0.3 V to

SVDD2 + 0.3 V

SYNCINB_x to DGND

DGND − 0.3 V to

DVDD + 0.3 V

SYSREF_x, TRIG_x to AVSSFS8

1.8 V

TMU_REFx to TMU_AGND

AGND − 0.3 V to

TMU_AVDD2 + 0.3 V

VCM to AGND

AGND − 0.3 V to

RVDD2 + 0.3 V

VREF to AGND

AGND − 0.3 V to

RVDD2 + 0.3 V

SERDOUT_x[x] to JGND

JGND − 0.3 V to JVTT + 0.3 V

Storage Temperature, TA

−40°C to +150°C

Operating Junction

Temperature (TJ)

125°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure.

θJC is the junction to case thermal resistance.

θJB is the junction to board thermal resistance.

Table 7. Thermal Resistance

Package Type

θJA

θJC

θJB

Unit

BP-192-1

20.5

1.6

9.2

°C/W

1 Thermal resistance values specified are simulated based on JEDEC specs in

compliance with JESD51-12.

ESD CAUTION

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