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TC35680FSG Datasheet(PDF) 18 Page - Toshiba Semiconductor

Part # TC35680FSG
Description  TC35680FSG-002/TC35681FSG-002 Bluetooth® Low Energy IC
PDF  91 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TC35680FSG Datasheet(HTML) 18 Page - Toshiba Semiconductor

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TC35680FSG-002/TC35681FSG-002
18
2019-04-04
Pin name
Pin No.
Attribute
Description
QFN
Package
Type
VDD/GND
VDD/GND
VDDIOFQ
27
VDDIOFQ
VDD
(Only TC35680)
This pin should be connected to an external capacitor for the
power supply of the built-in Flash memory (output).
This pin is connected to the power supply of the built-in Flash
memory. A load capacitor of 0.1
μF or more in the operation
temperature range should be connected for the LDO
regulator.
Any other use is not possible.
VSSD1
27
Digital
GND
(Only TC35681)
This pin should be connected to GND.
VSSA
8
Analog
GND
GND pin for the analog circuits.
This pin should be connected to GND.
VSSRFIO
6
Analog
GND
GND pin for RFIO.
This pin should be connected to GND.
VSSX
13
Analog
GND
GND pin for OSC.
This pin should be connected to GND.
VSSDC
20
Digital
GND
GND pin for the DC/DC converter.
This pin should be connected to GND.
VSSD
VSSD2(Note1)
FIN
Digital
GND
Die pad GND (FIN).
This pin is shared with the GND of the digital circuits.
The die pad on the bottom of the package should be
connected to GND.
Note1:Only TC35681



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