IMX93CEC datasheet(118/123 Pages) NXP

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Table 108. i.MX 93 Data Sheet document revision history...continued

Document ID

Release

date

Description

• Updated remarks in Table 4. Special signal considerations

• Added ADC and TAMPER pin information in Table 5. Unused function

strapping recommendations

• Updated Table 11. 11 x 11 mm FCPBGA thermal resistance data

• Updated NVCC_BBSM_1P8 description in Section 4.1.3, Power architecture

• Updated descriptions in Section 4.1.6.1, External clock sources

• Updated Figure 7, "Output transition time waveform"

• Updated Table 26. GPIO DC parameters and Table 27. Additional leakage parameters

• Removed JTAG_TRST information from Section 4.8.3, JTAG timing parameters

• Updated Table 63. ENET2 signal mapping and Table 67. ENET QOS signal mapping

• Updated footnotes of Table 69 and Table 70

• Updated Table 98. Fuses and associated pins used for boot

• Updated power group in 11 x 11 mm supplies contact assignments and functional

contact assignments and 9 x 9 mm supplies contact assignments and functional

contact assignments

Rev. 1

04/2023

• Initial version

NXP Semiconductors

IMX93CEC

i.MX 93 Applications Processors Data Sheet for Commercial Products

IMX93CEC

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 12 February 2026

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IMX93CEC Datasheet(PDF) 118 Page - NXP Semiconductors