OR4 datasheet(144/152 Pages) LATTICE

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144

Lattice Semiconductor

Data Sheet

May, 2006

ORCA Series 4 FPGAs

Package Thermal Characteristics

Table 70. ORCA Series 4 Plastic Package Thermal Guidelines

Note: The 416-pin PBGAM and the 680-pin PBGAM packages include 2 oz. copper plates

Package Coplanarity

The coplanarity limits of packages are as follows:

■

PBGA: 8.0 mils

■

PBGAM: 8.0 mils

Heat Sink Vendors for BGA Packages

In some cases the power required by the customers application is greater than the package can dissipate. Below,

in alphabetical order, is a list of heat sink vendors who advertise heat sinks aimed at the BGA market.

Table 71. Heat Sink Vendors

Package

ΘJA (°C/W)

Max Power

0 fpm

200 fpm

500 fpm

T = 70 °C Max

TJ = 125 °C Max

0 fpm (W)

352-Pin PBGA

19.0

16.0

15.0

2.9

416-pin PBGAM

18.0

16.5

13.5

3.1

680-Pin PBGAM

13.4

11.5

10.5

4.1

Vendor

Location

Phone

Aavid Thermalloy

Concord, NH

(603) 224-9988

Chip Coolers (Tyco Electronics)

Harrisburg, PA

(800) 468-2023

IERC (CTS Corp.)

Burbank, CA

(818) 842-7277

R-Theta

Buffalo, NY

(800) 388-5428

Sanyo Denki

Torrance, CA

(310) 783-5400

Wakeﬁeld Thermal Solutions

Pelham, NH

(603) 635-2800

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